2024
DOI: 10.1109/tetc.2016.2563323
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Notice of Violation of IEEE Publication Principles: An Energy-Efficient Heterogeneous Memory Architecture for Future Dark Silicon Embedded Chip-Multiprocessors

Abstract: Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related problems. Emerging non-volatile memory (NVM) technologies offer many desirable characteristics such as near-zero leakage power, high density and non-volatility. They can significantly mitigate the issue of memory leakage power in future embedded chip-multiprocessor (eCMP) s… Show more

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Cited by 6 publications
(1 citation statement)
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References 49 publications
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“…There are two cache level implemented stacked on the core layer using different memory technology: L2 cache uses SRAM while L3 cache uses STT-RAM. We choose STT-RAM because STT-RAM is the most promising candidate of NVM [20]. SRAM is close to the core layer and can take advantage of its low write overhead.…”
Section: Determination Of Dead Line and Write-burst Linementioning
confidence: 99%
“…There are two cache level implemented stacked on the core layer using different memory technology: L2 cache uses SRAM while L3 cache uses STT-RAM. We choose STT-RAM because STT-RAM is the most promising candidate of NVM [20]. SRAM is close to the core layer and can take advantage of its low write overhead.…”
Section: Determination Of Dead Line and Write-burst Linementioning
confidence: 99%