“…integration of devices have made heat conduction and dissipation crucially important, [1][2][3] which further poses the quick and versatile quantitative thermal characterization on the micro-/nano scale turn out to be a bottleneck for chip design, production, and performance evaluation. [4][5][6] Over the last few decades, the development of various experimental measurement techniques for the thermal properties of lowdimensional materials has generally fallen into two different categories: steady-state techniques based on Fourier's law, such as suspended-pad [7] and Raman optothermal [8,9] methods, and transient-state techniques completed before system equilibrium, such as three-omega, [10,11] timedomain thermoreflectance (TDTR), [12,13] frequency-domain thermoreflectance (FDTR), [14,15] and laser pulse thermal measurement. [16] However, all of the techniques listed above only provide an overall measurement value of the thermal conductivity for the samples, which is not desirable for understanding the local heat transport and further obtaining the one-to-one quantitative mapping of microstructures and thermal characteristics.…”