2002 IEEE Ultrasonics Symposium, 2002. Proceedings.
DOI: 10.1109/ultsym.2002.1193389
|View full text |Cite
|
Sign up to set email alerts
|

Nondestructive investigation of 4-inch langasite wafer acoustic homogeneity

Abstract: This paper reports an investigation of the freesurface SAW velocity homogeneity of 4-inch langasite wafers. The technique employed is fast, cheap, and nondestructive. The method is based on the determination of the SAW propagation time between two interdigital transducers (IDT), separated by a fixed distance. The measurement setup consists of an acoustic system comprising a sensor, the piezoelectric substrate under investigation, and a vector network analyzer HP-3577A. The sensor is fabricated on a non-piezoel… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 8 publications
(2 citation statements)
references
References 4 publications
0
2
0
Order By: Relevance
“…The acoustic waves are transmitted through the MUT and their propagation speeds are estimated [175]. The variation in the speeds of propagation is then mapped onto structural integrity [176] or material homogeneity [177]. This method requires a very good coupling between the probe and the surface of the MUT.…”
Section: H Nondestructive Testingmentioning
confidence: 99%
“…The acoustic waves are transmitted through the MUT and their propagation speeds are estimated [175]. The variation in the speeds of propagation is then mapped onto structural integrity [176] or material homogeneity [177]. This method requires a very good coupling between the probe and the surface of the MUT.…”
Section: H Nondestructive Testingmentioning
confidence: 99%
“…It was first introduced by Russian researchers in the 1980s and belongs to the trigonal crystal family [12]. It is suited to be applied at elevated temperature for its decent material price, good commercial availability of wafers, high melting point and stable piezoelectric properties in high temperature [13,14]. Various LGS-based SAW devices have already been achieved, including temperature sensors, pressure sensors, strain sensors, etc [15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%