Noncontact Modal Excitation of a Classical Guitar Using Ultrasound Radiation Force

Huber, Thomas M.; Beaver, Nathaniel M.; Helps, Justin R.

doi:10.1111/j.1747-1567.2011.00775.x

Cited by 12 publications

(8 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Through the capacitive air-coupled ultrasonic transducer (CAP3, ULTRAN Group), these magnified signals were transformed to the ultrasonic waves, which were projected onto the flip chip in continuous-wave mode. The ultrasonic waves would produce an ultrasonic radiation force on the object located in their transmission direction, exciting the test chip to vibrate [21]. Compared with the laser pulse excitation [18], the ultrasonic excitation has a narrow bandwidth, which can concentrate the excitation energy in the frequency range required for testing.…”

Section: Methodsmentioning

confidence: 99%

Defect detection of flip-chip solder joints using modal analysis

Liu¹,

Shi²,

Wang³

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

Section: Methodsmentioning

confidence: 99%

Defect detection of flip-chip solder joints using modal analysis

Liu¹,

Shi²,

Wang³

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

“…The resonance frequency of the system f i can be obtained from f i = ω i /2π. Huber and Fatemi have utilized ultrasonic waves to excite a MEMS mirror and MEMS gyroscope for modal testing [20]. It proves the feasibility of using ultrasonic waves to excite a very small device such as a flip chip in the tens to hundreds of kilohertz.…”

Section: Analytical Model and Detection Principlementioning

confidence: 99%

Detection of solder bump defects on a flip chip using vibration analysis

et al. 2012

View full text Add to dashboard Cite

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an aircoupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

show abstract

“…Huber et al (2007) utilized the ultrasonic radiation force to excite a MEMS mirror and MEMS gyroscope for modal testing. Kang et al (2010) exploited the ultrasonic radiation force to excite a micro-cantilever for evaluating its dynamic response.…”

Section: Theoretical Basis Of Ultrasonic Excitation and Vibration Anamentioning

confidence: 99%

Flip chip solder bump inspection using vibration analysis

et al. 2012

View full text Add to dashboard Cite

Flip chip technology is an attractive choice for high-density packaging and complex microsystem architectures. A critical element in the successful application of flip chip technology is the reliability of solder bumps. In this paper a nondestructive detection method is presented for the flip-chip solder bump inspection using ultrasonic excitation and vibration analysis. Simulations are implemented to explore the feasibility of this method, and experimental investigations are also performed, where the flip chips are excited by continuous ultrasonic waves and their vibration velocities are measured by a laser scanning vibrometer for further analysis. The results reveal that the defective chips can be distinguished from the good chips by the chip vibration velocities with the feature coefficient a, which proves the effectiveness of this method. Therefore, it may provide a new path for the improvement and innovation of flip chip on-line inspection systems.

show abstract

Noncontact Modal Excitation of a Classical Guitar Using Ultrasound Radiation Force

Cited by 12 publications

References 17 publications

Defect detection of flip-chip solder joints using modal analysis

Defect detection of flip-chip solder joints using modal analysis

Detection of solder bump defects on a flip chip using vibration analysis

Flip chip solder bump inspection using vibration analysis

Contact Info

Product

Resources

About