2012
DOI: 10.1016/j.microrel.2012.06.135
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Defect detection of flip-chip solder joints using modal analysis

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Cited by 7 publications
(3 citation statements)
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References 25 publications
(24 reference statements)
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“…e top module directly uses 1 × 1 convolution processing on the input features to obtain spatial global features [19]. e multilevel pooling module contains 3 downsampling parts to obtain three different resolution features of 1/2 input image, 1/4 input image, and 1/8 input image, respectively, and obtain context information of different scales until the input is restored feature size [20]. Finally, it is combined with the top module level as the final output of the structure [21].…”
Section: Recognition Methods Of Recursive Attention Model Formentioning
confidence: 99%
“…e top module directly uses 1 × 1 convolution processing on the input features to obtain spatial global features [19]. e multilevel pooling module contains 3 downsampling parts to obtain three different resolution features of 1/2 input image, 1/4 input image, and 1/8 input image, respectively, and obtain context information of different scales until the input is restored feature size [20]. Finally, it is combined with the top module level as the final output of the structure [21].…”
Section: Recognition Methods Of Recursive Attention Model Formentioning
confidence: 99%
“…Among them, a lot of studies [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 ] have focused on the inspection of solder joints, which is both important and challenging. Researchers have proposed a number of methods for solder joint inspection that use neural networks [ 1 , 2 ], fuzzy rules [ 3 ], Boolean rules [ 4 ], deep learning [ 5 ], support vector machines [ 6 ], decision trees [ 7 ], principle component analysis [ 8 ], modal analysis [ 9 ], etc. Component placement inspection is another significant and challenging problem, and it is the basis of other PCB inspections, such as the inspection of solder joints.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, many researchers have carried out studies on PCB inspection based on machine vision. Among them, a lot of studies [1][2][3][4][5][6][7][8][9][10][11] have focused on the inspection of solder joints, which is both important and challenging. Researchers have proposed a number of methods for solder joint inspection that use neural networks [1,2], fuzzy rules [3], Boolean rules [4], deep learning [5], support vector machines [6], decision trees [7], principle component analysis [8], modal analysis [9], etc.…”
Section: Introductionmentioning
confidence: 99%