Non-porous ultra-low-<i>k</i>SiOCH (<i>k</i>= 2.3) for damage-free integration and Cu diffusion barrier

Kikuchi, Yoshiyuki; Wada, Akira; Kurotori, Takuya; Sakamoto, Miku; Nozawa, Toshihisa; Samukawa, Seiji

doi:10.1088/0022-3727/46/39/395203

Cited by 13 publications

(17 citation statements)

References 23 publications

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“…Generally, in the PECVD process, precise control of molecular structure is difficult due to excess decomposition of material gas by plasma excitation. We have previously demonstrated the formation of a non-porous ultra-low-k SiOCH film with a sufficient film modulus [16] and conductive amorphous carbon (a-C:H) film at low temperature by NBECVD [17]. In particular, our conductive a-C:H film had the potential to be used as an electrode material for electrochemical measurements for Bio-LSI.…”

Section: Introductionmentioning

confidence: 96%

Amorphous carbon nitride thin films for electrochemical electrode: Effect of molecular structure and substrate materials

Kikuchi

Chang

Sakakibara

et al. 2015

Carbon

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Section: Introductionmentioning

confidence: 96%

Amorphous carbon nitride thin films for electrochemical electrode: Effect of molecular structure and substrate materials

Kikuchi

Chang

Sakakibara

et al. 2015

Carbon

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“…Iacopi and Zenasni also showed that the combination of thermal activation and UV radiation promotes a selective bond rearrangement of the organosilicate glass matrix that induces an improvement of about 40% in elastic modulus and hardness value [ 46 , 47 ]. More interestingly, Kikuchi et al recently reported that a large-radius neutral-beam-enhanced chemical vapor deposition (NBECVD) process can be used to precisely control the film structure so as to produce a non-porous ultralow-k SiCOH with a relatively high modulus (>10 GPa) [ 48 ]. Since artificial pores were not formed by this method, the resulting film did not incur any damage from wet (acid or alkali) or oxygen plasma-based BEOL processes [ 48 ].…”

Section: Introductionmentioning

confidence: 99%

“…More interestingly, Kikuchi et al recently reported that a large-radius neutral-beam-enhanced chemical vapor deposition (NBECVD) process can be used to precisely control the film structure so as to produce a non-porous ultralow-k SiCOH with a relatively high modulus (>10 GPa) [ 48 ]. Since artificial pores were not formed by this method, the resulting film did not incur any damage from wet (acid or alkali) or oxygen plasma-based BEOL processes [ 48 ].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Ma¹,

Bang

Son

et al. 2021

Materials

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This paper reported the enhancement in thermo-mechanical properties and chemical stability of porous SiCOH dielectric thin films fabricated with molecularly scaled pores of uniform size and distribution. The resulting porous dielectric thin films were found to exhibit far stronger resistance to thermo-mechanical instability mechanisms common to conventional SiCOH dielectric thin films without forgoing an ultralow dielectric constant (i.e., ultralow-k). Specifically, the elastic modulus measured by nano-indentation was 13 GPa, which was substantially higher than the value of 6 GPa for a porous low-k film deposited by a conventional method, while dielectric constant exhibited an identical value of 2.1. They also showed excellent resistance against viscoplastic deformation, as measured by the ball indentation method, which represented the degree of chemical degradation of the internal bonds. Indentation depth was measured at 5 nm after a 4-h indentation test at 400 °C, which indicated an ~89% decrease compared with conventional SiCOH film. Evolution of film shrinkage and dielectric constant after annealing and plasma exposure were reduced in the low-k film with a self-organized molecular film. Analysis of the film structure via Fourier-transform infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS) indicated an increase in symmetric linear Si–O–Si molecular chains with terminal –CH3 bonds that were believed to be responsible for both the decrease in dipole moment/dielectric constant and the formation of molecular scaled pores. The observed enhanced mechanical and chemical properties were also attributed to this unique nano-porous structure.

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“…[10][11][12] It is now generally believed that the barrier effect is referable to the "cold wall effect" and "vessel wall effect" exerted by the specific structure of the material . [13] As for the study of the mechanism of blocking explosionproof effects, four types of methods are mainly applied, including blocking of flames, attenuation of explosion shock waves, changes in temperature and pressure, and numerical simulation. P.V.…”

Section: Introductionmentioning

confidence: 99%

Structure Optimization and Flame Barrier Performance Evaluation of Barrier Explosion‐Proof Materials Based on FLACS

et al. 2020

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Blocking explosion-proof materials can quickly transfer heat, block flame propagation, and prevent explosion accidents. It has gradually become a rudimentary solution to the intrinsic safety of explosion or "secondary explosion" during the storage and transportation of flammable and explosive liquid or gaseous dangerous chemicals. The impact of the addition of explosion-proof porous materials in the storage tank on the shock wave was numerically simulated by FLACS and further analyzed with changes in pressure, temperature, and velocity. The effects of the configuration, size, aperture, layer spacing, and filling rate of the barrier explosion-proof ball on the barrier explosion-proof effect were investigated whereby the optimal barrier explosion-proof appearance structure was obtained. The explosion resistance tester was used to examine and evaluate the fire resistance performance of the material, and the influence of different types of barrier explosion-proof pellets on the fire resistance performance was revealed. The explosion suppression performance of the barrier explosion-proof material was evaluated by FLACS numerical simulation. The temperature and pressure in the storage tank can be greatly scaled down by adding the explosion-proof porous material. The numerical simulation results are coherent with that from experimental part, and the general rule of blocking explosion protection can be therefore identified: the turbulence effect is particularly obvious in the area filled with explosion-proof materials, and the porous spheres would continually reflect and weaken the shock wave. This makes it possible to significantly bring down the pressure and temperature after filling the explosion-proof area, thereby preventing explosions.[a] Dr. Figure 14. Flame blocking effect of different configurations of barrier explosion-proof materials. (a) Three-dimensional hollow structure fire resistance process: the time difference from the beginning to the extinction is 2440 ms, and the contact to the extinction time is 1.04 s; (b) The fire resistance process of a layer of perforated plate splicing configuration: the time difference from the beginning to the extinction is 2560 ms, and the contact to the extinction time is 1.32 s; (c) Multilayer orifice plate splicing configuration fire-blocking process: the time difference from the beginning to the extinction is 1720 ms, and the contact to the extinction time is 0.88 s. ChemistrySelectFull Papers

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Non-porous ultra-low-kSiOCH (k= 2.3) for damage-free integration and Cu diffusion barrier

Cited by 13 publications

References 23 publications

Amorphous carbon nitride thin films for electrochemical electrode: Effect of molecular structure and substrate materials

Amorphous carbon nitride thin films for electrochemical electrode: Effect of molecular structure and substrate materials

Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Structure Optimization and Flame Barrier Performance Evaluation of Barrier Explosion‐Proof Materials Based on FLACS

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