Non-Isothermal Crystallization Kinetics of Polyamide 6/h-Boron Nitride Composites

Wu, Xiang-Feng; Zhao, Yongke; Li, Hui; Zhao, Zehua; Sun, Yang; Zhang, Han; Yu, Maituo; Jia, Fanfan

doi:10.1080/00222348.2017.1280719

Cited by 8 publications

(4 citation statements)

References 18 publications

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“…On the other hand, melt crystallization traces of the composites exhibit a strong correlation with the weight fraction of the h-BN particles. Generally, the peak temperature obtained during the cooling cycle refers to the moment at which the crystallization rate reaches it maximum value . It can be seen in Figure b that the peak crystallization temperature values of the prepared composites are higher than that of the pure PEEK.…”

Section: Resultsmentioning

confidence: 95%

“…Generally, the peak temperature obtained during the cooling cycle refers to the moment at which the crystallization rate reaches it maximum value. 46 It can be seen in Figure 2b that the peak crystallization temperature values of the prepared composites are higher than that of the pure PEEK. This effect could be explained in terms of the nucleation effect of h-BN particles, which reduces the nucleation energy and increases the crystallization rate of the composite material, thus favoring the early onset of crystallization within the PEEK matrix.…”

Section: Effect Of H-bn Concentration On the Crystalline And Thermal ...mentioning

confidence: 87%

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Design of Highly Thermally Conductive Hexagonal Boron Nitride-Reinforced PEEK Composites with Tailored Heat Conduction Through-Plane and Rheological Behaviors by a Scalable Extrusion

Gul

Arican²,

Cansever³

et al. 2022

ACS Appl. Polym. Mater.

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The challenge of developing highly thermally conductive polymeric composites to meet the growing thermal management demands has recently attracted a lot of attention. To achieve a through-plane thermal conductivity higher than 2 W/mK, a high filler concentration within the poly(ether ether ketone) (PEEK) matrix is required, thus adding to the complexity of polymer processing. In this study, an optimized twin-screw extrusion melt-compounding technique was developed by tuning the melt flow of unfilled PEEK, feeding zones, and process cycles for dispersion of hexagonal boron nitride (h-BN) in the PEEK polymer. The prepared composites demonstrated exceptionally high in-plane and through-plane thermal conductivity of 12.451 and 2.337 W/mK, respectively, at 60 wt % h-BN loading. This improvement of thermal conduction in both directions can be attributed to two factors: (1) formation of through-thickness surface contacts between h-BN particles due to shear-driven exfoliation during compounding stage and (2) high degree of alignment of h-BN platelets achieved during molding stage. The calorimetric and thermogravimetric analyses indicated that the prepared composites possess enhanced crystallinity compared to unfilled PEEK and are thermally stable in elevated temperature ranges. The rheological characterization exhibited a progressive increase in viscosity and shear-thinning behavior of composite melts proportional to the h-BN concentration. Using the temperature and time-dependent rheological results, viscosity buildup profiles were constructed to outline allowable melt viscosity ranges for each composite composition. These profiles can be utilized to tailor the residence time of a composite melt by varying the filler concentration and process temperature during advanced manufacturing processes such as extrusion-based additive manufacturing and powder bed fusion. Hence, we provide a facile and industrially scalable method for development of h-BN-filled PEEK composites with high thermal dissipation characteristics aimed for thermal management in various harsh environment applications.

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Section: Resultsmentioning

confidence: 95%

Section: Effect Of H-bn Concentration On the Crystalline And Thermal ...mentioning

confidence: 87%

Design of Highly Thermally Conductive Hexagonal Boron Nitride-Reinforced PEEK Composites with Tailored Heat Conduction Through-Plane and Rheological Behaviors by a Scalable Extrusion

Gul

Arican²,

Cansever³

et al. 2022

ACS Appl. Polym. Mater.

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“…Moreover, the related kinetic parameters were listed in Table . In Table , it can be clearly observed that the Avrami exponent n range from 2 to 4, and only a small amount of data are above 3, which implies that the primary crystallization process might mainly corresponding to two‐dimensional or three‐dimensional during the primary crystallization process . Furthermore, the values of Z c increase gradually with increment of the cooling rate, suggesting the higher crystallization rate with an increase in cooling rate.…”

Section: Resultsmentioning

confidence: 96%

Synthesis and nonisothermal crystallization kinetics of thermoplastic polyamide‐6 elastomers

Huang

Lan

Song

et al. 2018

J of Applied Polymer Sci

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Three kinds of thermoplastic polyamide‐6 elastomers (TPAEs) with varying polytetramethyleneglycol (PTMG) contents of 10, 20, and 30 wt % were prepared via a one‐pot polymerization synthetic route and named as TPAE1, TPAE2, and TPAE3, respectively. First, their structures were investigated by Fourier transform infrared spectroscopy, proton nuclear magnetic resonance spectroscopy, scanning electron microscope, and X‐ray diffraction. The obtained results confirmed that targeted TPAEs were successfully synthesized and the unit cell of crystallization in TPAEs with α form was confirmed. Subsequently, the thermal properties of prepared TPAEs were characterized by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) measurements, respectively. DSC curves showed that melting points of synthesized TPAEs were in the range of 209.2–215.9 °C. Moreover, TGA results showed TPAEs possess good thermal stability and cannot be decomposed under 300 °C. Additionally, the modified Avrami's equation, Ozawa's theory, and Mo's method were employed to investigate the nonisothermal crystallization kinetics of prepared TPAEs. It is found that the Mo's method exhibited great advantages in treating the nonisothermal crystallization kinetics of prepared TPAEs. Meanwhile, the crystallization kinetics and halftime are influenced by the contents of PTMG and follows a nonlinear fashion in agreement with the trend inactivation energies calculated by the Kissinger method. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47388.

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“…The preparation of PA 6 composites depends on the dispersion of fillers, and good dispersion is beneficial to the performance of the composites. A lot of research had been done on PA 6/h-BN composites mainly on flame retardant properties [1], thermal conductivity [4,5] and crystallization properties [6,7]. The key to the preparation of PA 6 composites lies in the dispersibility of the fillers.…”

Section: Intruductionmentioning

confidence: 99%

The high thermal conductivity composite of PA 6/h-BN prepared by micron mixing in the solution

Shang,

Wu,

et al. 2024

Preprint

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The polyamide 6 powder was prepared by the liquid phase method, and then mixed with hexagonal boron nitride (h-BN) in a high-pressure homogenizer for micron-level mixing, and finally the composite material is obtained by hot pressing. The thermal conductivity of composites was as high as 1.73 W/(m•K). The results showed that the dispersion of h-BN in the matrix was well and there was no obvious agglomeration in the composite from the scanning electron microscope. Differential scanning calorimetry and X-ray diffraction results showed that h-BN affects the crystalline of polyamide 6 and the thermal stability of the composites was improved. The composite is expected to be used in high thermal conductivity functional plastics.

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Non-Isothermal Crystallization Kinetics of Polyamide 6/h-Boron Nitride Composites

Cited by 8 publications

References 18 publications

Design of Highly Thermally Conductive Hexagonal Boron Nitride-Reinforced PEEK Composites with Tailored Heat Conduction Through-Plane and Rheological Behaviors by a Scalable Extrusion

Design of Highly Thermally Conductive Hexagonal Boron Nitride-Reinforced PEEK Composites with Tailored Heat Conduction Through-Plane and Rheological Behaviors by a Scalable Extrusion

Synthesis and nonisothermal crystallization kinetics of thermoplastic polyamide‐6 elastomers

The high thermal conductivity composite of PA 6/h-BN prepared by micron mixing in the solution

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