2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021
DOI: 10.1109/ectc32696.2021.00122
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Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging

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Cited by 4 publications
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“…From Chen’s [ 7 ] research, it was shown that Kamal’s model is reliable in cure kinetics and the Castro–Macosko model is considerably more stable and reliable in flow rheology. Moon’s [ 8 ] research shows that predicting viscosity by Kamal’s Equation is consistent with the viscosity measured by the rheometer. Azmi’s [ 9 ] research pointed out that the air trap, or a void that occurs at the chips, obviously, exacerbates flow retardation and also leads to a popcorn effect and least reliability.…”
Section: Introductionmentioning
confidence: 54%
“…From Chen’s [ 7 ] research, it was shown that Kamal’s model is reliable in cure kinetics and the Castro–Macosko model is considerably more stable and reliable in flow rheology. Moon’s [ 8 ] research shows that predicting viscosity by Kamal’s Equation is consistent with the viscosity measured by the rheometer. Azmi’s [ 9 ] research pointed out that the air trap, or a void that occurs at the chips, obviously, exacerbates flow retardation and also leads to a popcorn effect and least reliability.…”
Section: Introductionmentioning
confidence: 54%