1992
DOI: 10.1109/55.192801
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Nine-state resonant tunneling diode memory

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Cited by 108 publications
(33 citation statements)
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“…In this case, the individual devices exhibit two NDR regions so that the latch has three stable voltage states. However, vertically integrated RTDs can be built with many current peaks and a RAM with up to nine states has been reported [43]. As the RTD is formed from a vertically layered stack, the logic devices may be simply built on top such that the top of the RTD mesa forms either the back gate of the DG CMOS device (Figure 9).…”
Section: Nano-scale Configuration Mechanismsmentioning
confidence: 99%
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“…In this case, the individual devices exhibit two NDR regions so that the latch has three stable voltage states. However, vertically integrated RTDs can be built with many current peaks and a RAM with up to nine states has been reported [43]. As the RTD is formed from a vertically layered stack, the logic devices may be simply built on top such that the top of the RTD mesa forms either the back gate of the DG CMOS device (Figure 9).…”
Section: Nano-scale Configuration Mechanismsmentioning
confidence: 99%
“…In the CNT case, a high resistance connection would to be made to bias the gate. Merging these technologies into an integrated unit will involve (amongst other challenges) matching the required configuration values (V G ) with the RTD tunneling voltages which are, in turn, determined by the thickness of each barrier layer in the RTDs [43]. While it has been suggested in [9] that III-V technology appears to be the most promising candidate for large scale integration of RTDs, silicon interband tunnel diodes with adequate room temperature peak-to-valley current ratios have recently been reported [19], [22] and may turn out to be easier and cheaper to fabricate.…”
Section: Nano-scale Configuration Mechanismsmentioning
confidence: 99%
“…In particular, the multiple-peak NDR circuits provide the convenience to implement the multiplevalued logic (MVL) circuit [3]- [5]. Compared to traditional binary logic, the MVL can transfer more information with fewer interconnects between devices and circuits.…”
Section: Introductionmentioning
confidence: 99%
“…Functional density can be further improved by using vertically stacked RTDs in multistate memory and logic [12,13]. Analog circuits are also achievable, and a prototype 4 bit, 2 Gsps flash-ADC has been implemented [14].…”
Section: Introductionmentioning
confidence: 99%