Next Generation “Zen 3” Core

Evers, Mark; Barnes, Leslie; Clark, Mike

doi:10.1109/hcs52781.2021.9567108

Cited by 11 publications

(2 citation statements)

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“…In addition, there are NNPIM and CMP-PIM for neural network acceleration, etc. [ 12 , 13 , 14 , 15 ]. The current research direction of PIM technology is mainly based on volatile memory and non-volatile memory.…”

Section: Present Situation Of Processing-in-memory Technologymentioning

confidence: 99%

“…Memory and processor cores are integrated into the same package by Chiplet using advanced packaging technology. A typical representative of this type of PIM architecture is the AMD Zen series CPUs [ 12 , 25 , 26 ]. As shown in Figure 2 a, the “Rome” CPU built on Zen 2 contains up to eight CCD Chiplets paired with a single IO-die Chiplet [ 26 ].…”

Section: Present Situation Of Processing-in-memory Technologymentioning

confidence: 99%

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Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions

Tian

Zhao

et al. 2022

Micromachines

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With the rapid development of 5G, artificial intelligence (AI), and high-performance computing (HPC), there is a huge increase in the data exchanged between the processor and memory. However, the “storage wall” caused by the von Neumann architecture severely limits the computational performance of the system. To efficiently process such large amounts of data and break up the “storage wall”, it is necessary to develop processing-in-memory (PIM) technology. Chiplet combines processor cores and memory chips with advanced packaging technologies, such as 2.5D, 3 dimensions (3D), and fan-out packaging. This improves the quality and bandwidth of signal transmission and alleviates the “storage wall” problem. This paper reviews the Chiplet packaging technology that has achieved the function of PIM in recent years and analyzes some of its application results. First, the research status and development direction of PIM are presented and summarized. Second, the Chiplet packaging technologies that can realize the function of PIM are introduced, which are divided into 2.5D, 3D packaging, and fan-out packaging according to their physical form. Further, the form and characteristics of their implementation of PIM are summarized. Finally, this paper is concluded, and the future development of Chiplet in the field of PIM is discussed.

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