New technology for electrical/optical systems on module and board level: the EOCB approach

Krabe, D.; Ebling, F.; Arndt-Staufenbiel, Norbert; Lang, G.; Scheel, Wolfgang

doi:10.1109/ectc.2000.853285

Cited by 53 publications

(14 citation statements)

References 2 publications

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“…8. On a PCB, optical inserts as demonstrated in Krabe 2000 could open up a new field for this PCB compatible embedding approach. Using thin, flexible batteries (Fig.…”

Section: Future Stepsmentioning

confidence: 98%

Ultra thin chips for miniaturized products

Jung¹,

Ostmann

Wojakowski³

et al. 2003

Microsystem Technologies

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The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. One key to miniaturization developed in the past was the use of unpackaged, bare dice. Saving the volume and weight of the package, significant reduction in footprint was achieved. A next step conceived to further the miniaturization is the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP), in contrast to a full silicon integration (System-on-Chip, SoC). The use of recent manufacturing methods allows to merge the SiP approach with a volumetric integration. Up to now, most of the systems utilize single- or double-sided populated system carriers. Embedding of passive components was a first step forward. A new challenge is to incorporate not only passive components, but active circuitry (IC's) and the necessary thermal management as well. Ultra thin chips (i.e. silicon dies thinned down to similar to50 mum total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB's. Micro via technology allows to connect the embedded chip to the outer faces of the system circuitry. As an ultimate goal for microsystem integration, the embedding of optical and fluidical system components can be envisioned. This paper presents the first approach to embed thin silicon dies in to polymeric system carriers. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. To reach the goal of a vertically stackable "box-of-bricks" type of ultra thin (UT) package, thin silicon chips are embedded and interconnected on a peripheral UT BGA

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“…8. On a PCB, optical inserts as demonstrated in Krabe 2000 could open up a new field for this PCB compatible embedding approach. Using thin, flexible batteries (Fig.…”

Section: Future Stepsmentioning

confidence: 98%

Ultra thin chips for miniaturized products

Jung¹,

Ostmann

Wojakowski³

et al. 2003

Microsystem Technologies

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show abstract

“…Several optical interconnect techniques such as free space, guided wave, board level, and fiber array interconnections were introduced for system-level applications [7]- [11]. They successfully demonstrated high-speed optical interconnection; however, there were still packaging difficulties.…”

Section: Introductionmentioning

confidence: 99%

Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects

Choi

Lin

Liu

et al. 2004

J. Lightwave Technol.

149

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Abstract-This paper demonstrates a flexible optical waveguide film with integrated optoelectronic devices (vertical-cavity surfaceemitting laser (VCSEL) and p-i-n photodiode arrays) for fully embedded board-level optical interconnects. The optical waveguide circuit with 45 micromirror couplers was fabricated on a thin flexible polymeric substrate by soft molding. The 45 couplers were fabricated by cutting the waveguide with a microtome blade. The waveguide core material was SU-8 photoresist, and the cladding was cycloolefin copolymer. A thin VCSEL and p-i-n photodiode array were directly integrated on the waveguide film. Measured propagation loss of a waveguide was 0.6 dB/cm at 850 nm.Index Terms-embedded optical interconnects, 45 micromirror coupler, printed circuit board (PCB), poly(dimethylsiloxane) (PDMS), soft molding, SU-8, topas, vertical-cavity surface-emitting laser (VCSEL), waveguide film.

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“…The most critical point that needs to be addressed is the low-cost manufacturing and the compatibility with current PCB production. The many methods used for redirecting light into the PCB up to this point [1][2][3] failed to provide a cost-effective solution to the interconnect problem. Our investigation therefore concentrates on the solution where a 45° mirror is used for redirecting the light, and the particular manufacturing method that allows easy integration into the PCB manufacturing process.…”

Section: Coupling Structuresmentioning

confidence: 99%

“…These include embedded fibers bent to redirect light perpendicular to the surface. Other solutions favor the "periscope" [1,3] where chips carry the active devices and guide light directly into and out of the embedded optical waveguide, and many others. Our investigation concentrates on the solution where a 45° mirror is used for redirecting the light, and the particular manufacturing method that allows easy integration into the PCB manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

“…The research will evaluate existing and novel optical materials and take advantage of industry standard high-density integration and explore new technologies. While many of the objectives of optical data connections on PCBs have been addressed at length by many groups [1][2][3][4][5][6][7][8], the cost effective manufacturing of coupling structures for guiding light into optical waveguides has still not been solved in a way that would enable optical PCBs reach a state where broad implementation can be expected. Different solutions provide highly parallel optical chip-to-chip data transmission [7]; other solutions provide interconnections based on MT ferrule design [9].…”

Section: Introductionmentioning

confidence: 99%

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Laser ablated coupling structures for optical printed circuit boards

Steenberge¹,

Geerinck

Riester

et al. 2005

SPIE Proceedings

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We report on the cost effective fabrication of 45° micromirror couplers within single-mode polymer waveguides for achieving fully embedded board-level optoelectronic interconnections. Compatibility with existing board manufacturing technology is achieved by making use of polymers with high thermal stability. The sol-gel polymers behave as negative photo resist and waveguides are patterned by UV exposure. Micromirrors are fabricated using excimer laser ablation, a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UVabsorption properties and highly non-thermal ablation behavior. A coupling structure based on total internal reflection (TIR) is enhanced by developing a process for embedding a metal coated 45° mirror in the optical layers. The mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Surface roughness of both the mirrors and the upper cladding surface above the mirrors is investigated using a non-contact optical profiler. Initial loss measurements at 1.3 µm show a propagation loss of 0.62 dB/cm and an excess mirror loss of 1.55 dB. During most recent experiments mirror roughness has been reduced from 160 nm to 20 nm, which will seriously reduce the mirror loss.

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New technology for electrical/optical systems on module and board level: the EOCB approach

Cited by 53 publications

References 2 publications

Ultra thin chips for miniaturized products

Ultra thin chips for miniaturized products

Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects

Laser ablated coupling structures for optical printed circuit boards

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