New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor Devices

Nakamura, Yoshinobu; Uenishi, Shouichi; Kunishi, Tatsuo; Miki, Kyosuke; Tabata, H.; Kuwada, Kenji; Suzuki, Hideto; Matsumoto, Takuya

doi:10.1109/tchmt.1987.1134798

Cited by 29 publications

(2 citation statements)

References 6 publications

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“…The magnitude of the internal stress is sufficient to cause both package and chip-related failures, which have been well reported in the literature [l], One of the challenges facing package manufacturers is to reduce and or eliminate these internal stresses. The development of low stress molding compounds, "softer" die attach materials, and the use of die coatings are among the most commonly adopted approaches of achieving this aim [3], [4]. Although stress sensing test chips can be difficult to calibrate accurately [5], they are widely used as a means of confirming whether the material or structural changes to packages do indeed reduce the magnitude of stress on the chip [6], [7].…”

Section: Introductionmentioning

confidence: 99%

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

Kelly

Lyden

Lawton

et al. 1996

IEEE Trans. Comp., Packag., Manufact. Technol. B

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This paper addresses the use of finite element (FE) techniques to predict residual warpage in plastic quad flat packs (PQFP's) after encapsulation. Experimental measurements of package warpage are used to validate FE models of the packages. Failure to incorporate mold compound chemical shrinkage into the FE analysis leads to erroneous predictions of package warpage. The warpage sensitivity of different packages to changes in downset is presented. The validated FE package models predict stress levels in packages which are 70% greater than those with temperature coefficient of expansion (TCE) shrinkage alone and questions the accuracy of previous simulations which do not include molding compound chemical shrinkage. j I:

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Section: Introductionmentioning

confidence: 99%

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

Kelly

Lyden

Lawton

et al. 1996

IEEE Trans. Comp., Packag., Manufact. Technol. B

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“…Ever larger and more complex silicon devices, further narrowing of trace width, compaction and reduction in thickness of packages, speed, and heat flux have resulted in the development of new encapsulant technology. [4] Assembly operations such as high temperature soldering of surface mount components result in serve thermal stress on the polymer causing damage at the interfacial areas of the silicon die and encapsu Ian t.…”

Section: Fabrication and Assembly Sequencesmentioning

confidence: 99%

Thermal phenomena during the encapsulation of electronic devices

Emerson

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-Therm '88

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As the complexity of integrated circuit packaging increases, the thermo-mechanical integrity of the package becomes critical because of thermal stresses induced by the fabrication and operating temperature range. A variety of materials with a wide range in thermal expansion coefficients, modulus and crack propagation properties (toughness) are required. The stresses induced in the encapsulation and fabrication processes and subsequent assembly operations are usually larger because of the mismatch in material properties than the stresses during service ambient. Thermomechanical stresses from different materials in the package as related to assembly and testing provide designers with difficult choice of options. Review of thermally-induced failures of encapsulated devices in relation to fabrication and assembly sequences and testing will be discussed for broad product applications.

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Synthesis of aralkyl novolac epoxy resins and their modification with polysiloxane thermoplastic polyurethane for semiconductor encapsulation

Ho¹,

Wang

1999

J. Appl. Polym. Sci.

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A series of phenol-based and naphthol-based aralkyl epoxy resins were synthesized by the condensation of p-xylylene glycol with phenol, o-cresol, p-cresol, or 2-naphthol, respectively, followed by the epoxidation of the resulting aralkyl novolacs with epichlorohydrin. The incorporation of stable dispersed polysiloxane thermoplastic polyurethane particles in the synthesized epoxy resin's matrix was achieved via epoxy ring-opening with the isocyanate groups of urethane prepolymer to form an oxazolidone. The mechanical and dynamic viscoelastic properties of cured aralkyl novolac epoxy resins were investigated. A sea-island structure was observed in all cured rubber-modified epoxy networks via SEM. The results indicate that a naphthalene containing aralkyl epoxy resin has a low coefficient of thermal expansion, heat resistance, and low moisture absorption, whereas phenol aralkyl type epoxy resins are capable of imparting low elastic modulus result in a low stress matrix for encapsulation applications. Modification of the synthesized aralkyl epoxy resins with polysiloxane thermoplastic polyurethane have effectively reduced the stress of cured epoxy resins, whereas the glass transition temperature was increased because of the formation of the rigid oxazolidone structure.

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New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor Devices

Cited by 29 publications

References 6 publications

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

Thermal phenomena during the encapsulation of electronic devices

Synthesis of aralkyl novolac epoxy resins and their modification with polysiloxane thermoplastic polyurethane for semiconductor encapsulation

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