New on-chip screening of gate oxides smart power devices for automotive applications

Malandruccolo, Vezio; Ciappa, Mauro; Rothleitner, H.; Fichtner, W.

doi:10.1109/irps.2009.5173313

Cited by 4 publications

(5 citation statements)

References 8 publications

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“…Furthermore, the BI-GST approach enables the manufacturer to perform a targeted GST on packaged devices, which has not been possible until this time with the use of traditional GST solution. This fact removes the need to perform burn-in and reduces the test time to few milliseconds, as described in our recent work [7].…”

Section: A Working Principlementioning

confidence: 91%

“…The principles of the novel solution developed for built-in GST (BI-GST) have been originally presented in our previous work [7], where the concept and circuit realization have been shown together with circuit simulation results. Later, the modifications that are needed to add the built-in DLT (BI-DLT) functionality in the existing circuits have been presented [8].…”

Section: New Built-in Defect-based Techniquementioning

confidence: 99%

See 1 more Smart Citation

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Malandruccolo

Ciappa

Rothleitner

et al. 2011

IEEE Trans. Device Mater. Relib.

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Efficient screening procedures for the control of defectivity are vital to limit early failures, particularly in critical automotive applications. Traditional strategies based on burn-in and in-line tests are able to provide the required level of reliability, but they are expensive and time consuming. This paper presents a novel built-in circuitry to screen out gate oxide and crystalrelated defects in Lateral Diffused MOS transistors. The proposed technique is based on an embedded circuitry that includes control logic, high-voltage generation, and leakage current monitoring. The concept and the advantages of the proposed screening procedure are described in detail and demonstrated experimentally in conjunction with the integration of a test chip.Index Terms-Built-in self-test, burn-in, crystal defects, gate oxide reliability, gate stress test (GST).

show abstract

Section: A Working Principlementioning

confidence: 91%

Section: New Built-in Defect-based Techniquementioning

confidence: 99%

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Malandruccolo

Ciappa

Rothleitner

et al. 2011

IEEE Trans. Device Mater. Relib.

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show abstract

“…Furthermore, the BI-GST approach enables the manufacturer to perform a targeted GST after packaging of the device what it has not been possible until nowadays by the use of the traditional GST solution. This fact removes the need to perform burn-in and reduces the test time to some milliseconds as it has been shown in [5].…”

Section: ) Working Principlementioning

confidence: 92%

“…Subsequently, the eventual occurrence of the oxide breakdown is detected by the measurement of the leakage current through the gate oxide [5]. A typical configuration of such a circuitry is shown in Fig.…”

Section: ) Traditional Screening Procedures For Thick Gate Oxidesmentioning

confidence: 99%

In situ screening techniques for defective oxides in devices for automotive applications

Malandruccolo¹,

Ciappa²,

Fichtner³

et al. 2011

2011 International Reliability Physics Symposium

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Efficient screening procedures for the control of the defectivity are vital to limit early failures especially in critical automotive applications. Traditional strategies based on burn-in and in-line tests are able to provide the required level of reliability but they are expensive and time consuming. This paper presents novel built-in circuitries to screen out oxide defects in integrated circuits for the most important building blocks used in automotive applications. The proposed techniques are based on an embedded circuitry that includes control logic, high voltage generation, and leakage current monitoring. The concept and advantages of the proposed screening procedure are described in very detail and demonstrated experimentally in conjunction with the integration of test-chips.

show abstract

“…Furthermore, the BI-GST approach enables the manufacturer to perform a targeted GST after packaging of the device what it has not been possible until nowadays by the use of the traditional GST solution. This fact removes the need to perform burnin and reduces the test time to some milliseconds as it has been shown in [4].…”

Section: Advantages Of the Bi-gstmentioning

confidence: 92%

A new built-in screening methodology to achieve zero defects in the automotive environment

Malandruccolo

Ciappa

Rothleitner

et al. 2009

Microelectronics Reliability

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New on-chip screening of gate oxides smart power devices for automotive applications

Cited by 4 publications

References 8 publications

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

In situ screening techniques for defective oxides in devices for automotive applications

A new built-in screening methodology to achieve zero defects in the automotive environment

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