2013 IEEE International Conference on Microelectronic Test Structures (ICMTS) 2013
DOI: 10.1109/icmts.2013.6528153
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New methodology for drain current local variability characterization using Y function method

Abstract: 5.2International audienc

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Cited by 11 publications
(3 citation statements)
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“…Dividing the drain current by the square root of the transconductance in (25) serves the purpose of canceling those effects [69,70]. Once the degradation effects are canceled out, the resulting ''Y'' function is supposed to become a straight line for V G ) V T , which can be then extrapolated to intersect the V G axis at V G = V T [71].…”
Section: The ''Y'' Functionmentioning
confidence: 99%
“…Dividing the drain current by the square root of the transconductance in (25) serves the purpose of canceling those effects [69,70]. Once the degradation effects are canceled out, the resulting ''Y'' function is supposed to become a straight line for V G ) V T , which can be then extrapolated to intersect the V G axis at V G = V T [71].…”
Section: The ''Y'' Functionmentioning
confidence: 99%
“…According to Eq. ( 1), the current mismatch could be attributed to uncorrelated origins of parameter variations: V TH , β, and R SD where β=μ 0 C ox V D W/L current gain factor, and R SD the source/drain series resistance [1,2].…”
Section: Device Information and Experimental Setupmentioning
confidence: 99%
“…In particular, the double-gate (DG) sensing mode of ISFETs can amplify sensitivity through capacitive coupling considering the capacitances of the gate electrodes positioned above and below the thin-film channel without additional amplifying circuitry [11]. Meanwhile, the increase in series resistance and capacitance of the source/drain (S/D) junction of the ISFET due to miniaturization and integration of biomedical sensors can limit rapid biosignal responses, which are important for understanding S/D formation in early diagnosis and improved therapy in the future [12,13]. Typically, S/D formation is achieved via high-dose ion implantation and high-temperature activation annealing processes.…”
Section: Introductionmentioning
confidence: 99%