1992
DOI: 10.1007/bf00543940
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New method for the measurement of stress in thin drying gel layers, produced during the formation of ceramic membranes

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1992
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Cited by 33 publications
(17 citation statements)
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“…Hence sol-gel processing offers merits over other techniques, such as high purity, homogeneity, stoichiometry control, the ability to coat large and complex area substrates, ease of processing and the possibility of lowering processing temperatures. 24,25 Techniques such as Raman scattering (RS), 26 -28 optical fluorescence, 29 x-ray diffraction (XRD), 26,30 laser reflectance, 16 cantilever beam deflection 31 and wafer curvature 32 measurements have been used to determine the stress in ferroelectric materials in general and extensively of lead titanate. To the best of the author's knowledge, no extensive Raman studies exist concerning the evaluation of stress in sol-gel-derived BT thin films although RS has been used in the study of the physical properties of BT.…”
Section: Introductionmentioning
confidence: 99%
“…Hence sol-gel processing offers merits over other techniques, such as high purity, homogeneity, stoichiometry control, the ability to coat large and complex area substrates, ease of processing and the possibility of lowering processing temperatures. 24,25 Techniques such as Raman scattering (RS), 26 -28 optical fluorescence, 29 x-ray diffraction (XRD), 26,30 laser reflectance, 16 cantilever beam deflection 31 and wafer curvature 32 measurements have been used to determine the stress in ferroelectric materials in general and extensively of lead titanate. To the best of the author's knowledge, no extensive Raman studies exist concerning the evaluation of stress in sol-gel-derived BT thin films although RS has been used in the study of the physical properties of BT.…”
Section: Introductionmentioning
confidence: 99%
“…Under conditions of small deflection and film thickness relative to substrate thickness, 6 is related to the stress in the film, s, by Stoney's equation [9]: s = E, d, ! / (3L2 ( 1-VJ df) 6 where E, is Young's modulus of the substrate, d, is the substrate thickness, d, is the film thckness and v, is the substrate Poisson ratio.…”
Section: Solvent Exchanged A2 Solsmentioning
confidence: 99%
“…We have used a beam bending technique [8] to measure the change in solvation stress in a thin film as a result of adsorption [9]. The method employs the measurement of both the kinetics and the magnitude of change in stress induced in a porous f i l m as a result of changing the overlying relative vapor pressure, P/P,.…”
Section: Introductionmentioning
confidence: 99%
“…In the past, optical fluorescence [12], X-ray diffraction (XRD) [13], wafer curvature measurements [14], cantilever beam deflection [15], laser reflectance [16] and Raman spectroscopy [17][18][19][20][21][22][23][24] have been used for stress analysis of ferroelectric materials. Among them, XRD and Raman 3 spectroscopy are the most popular techniques, as they are powerful tools for non-destructive investigation of structure.…”
Section: Introductionmentioning
confidence: 99%