New method for producing power electronic circuit boards by cold-gas spraying and investigation of adhesion mechanisms

The Study of Linear Correlation Between Surface Roughness Parameters and Adhesion of Flame Sprayed Coatings

“…For a most of thermal spraying processes, the adhesion between the coating and the substrate primarily depends on the mechanical interlocking, which is mainly related to the substrate surface roughness and the solidification of impacting droplets. The mechanical interlocking effect increased with the improvement in the melting state of sprayed particle and the increase in roughness of substrate surface [2,6,8,10,15,16].…”

Determination of plastic constitutive properties of microparticles through single particle compression

“…as an alternative to conventional powder metallurgy, but with the advantage of eliminating the sintering stage [4][5][6]. A specific application of cold spray is in high-power electrical components, where oxygen-free high-conductivity deposits of copper and aluminium can be obtained at relatively low costs [17,18]. In cold spraying, the final properties of the deposits are governed by thermal and mechanical properties of particles of the feedstock [19].…”

Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

“…To achieve the desired adhesion strength, many factors have to be considered to develop a better bonding between different materials. In the study of joining method, various techniques such as eutectic joining [4,5,[7][8][9][10], ion beam dynamic mixing [11], casting bonding [7], spraying [12,13], etc., have been explored to obtain optimized bonding. Besides, insertion of an adhesion layer such as titanium [14], chromium [14,15] or tantalum is often employed before the final metal film is deposited on a ceramic substrate.…”