New high current low energy ion source

Hara, Tamio

doi:10.1116/1.583904

Cited by 67 publications

(16 citation statements)

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“…EBEP enables the production of highly ionized plasma at low pressures by adjusting electron beam energy close to the maximum electron impact ionization energy of the source gas. The higher density of source gas inside the EBEP system increases the pressure inside the chamber, which assists in controlling the morphology of CNWs [ 44 , 45 ]. In addition to these plasma-enhanced deposition techniques, several reports on the growth of carbon nanostructures and graphene flakes have been successfully demonstrated by arc discharge plasma [ 46 , 47 ].…”

Section: Plasma: Potential Approach For Carbon Nanowall (Cnw) Syntmentioning

confidence: 99%

Oriented Carbon Nanostructures by Plasma Processing: Recent Advances and Future Challenges

et al. 2018

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Carbon, one of the most abundant materials, is very attractive for many applications because it exists in a variety of forms based on dimensions, such as zero-dimensional (0D), one-dimensional (1D), two-dimensional (2D), and-three dimensional (3D). Carbon nanowall (CNW) is a vertically-oriented 2D form of a graphene-like structure with open boundaries, sharp edges, nonstacking morphology, large interlayer spacing, and a huge surface area. Plasma-enhanced chemical vapor deposition (PECVD) is widely used for the large-scale synthesis and functionalization of carbon nanowalls (CNWs) with different types of plasma activation. Plasma-enhanced techniques open up possibilities to improve the structure and morphology of CNWs by controlling the plasma discharge parameters. Plasma-assisted surface treatment on CNWs improves their stability against structural degradation and surface chemistry with enhanced electrical and chemical properties. These advantages broaden the applications of CNWs in electrochemical energy storage devices, catalysis, and electronic devices and sensing devices to extremely thin black body coatings. However, the controlled growth of CNWs for specific applications remains a challenge. In these aspects, this review discusses the growth of CNWs using different plasma activation, the influence of various plasma-discharge parameters, and plasma-assisted surface treatment techniques for tailoring the properties of CNWs. The challenges and possibilities of CNW-related research are also discussed.

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Section: Plasma: Potential Approach For Carbon Nanowall (Cnw) Syntmentioning

confidence: 99%

Oriented Carbon Nanostructures by Plasma Processing: Recent Advances and Future Challenges

et al. 2018

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“…Surface treatment of the p‐type silicon substrates was performed through keeping them in argon plasma generated by an electron‐beam excited plasma system; in so doing, electron irradiation was conducted for 1, 3, 5, 10 and 30 minutes under voltage of +50 V applied to the substrate (Figure ). In this treatment, current flowing in the substrate was about 20 mA/cm 2 .…”

Section: Experimental Methodsmentioning

confidence: 99%

Deposition of uniform carbon film on silicon substrate by chemical solution process

Hashimoto

Suzumura

2019

Elect Comm in Japan

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Uniform carbon film was grown on silicon substrate treated by low energy electron at temperature of 60° in the methanol solution. The treatment was carried out to modify the silicon surface by electron irradiation of 50 eV using electron‐beam‐excited plasma. From the results of Raman and X‐ray diffraction spectra, it was confirmed that the film is crystalline carbon containing small amounts of diamond component. The ID/IG ratio and work function of carbon film increased with increasing treatment time of the silicon substrate. The increases of ID/IG ratio and work function suggest that the carbon film had greater concentration of diamond component. On the other hand, the surface roughness and work function of the silicon substrate increased due to an increase of treatment time. The variations of physical and electronic properties are attributed to carbon deposition during the growth process.

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“…The samples after barrel nitriding were nitrided using an electron beam excited plasma (EBEP) source. The EBEP source is a unique electron beam source that can produce amperes of beam current with a beam kinetic energy less than 100 eV, which is lower by several orders of magnitude than the energy of electron beams produced by other ordinary beam sources 9. The vacuum chamber was evacuated below 10 −4 Pa before processing.…”

Section: Experimental Partmentioning

confidence: 99%

“…The EBEP source is a unique electron beam source that can produce amperes of beam current with a beam kinetic energy less than 100 eV, which is lower by several orders of magnitude than the energy of electron beams produced by other ordinary beam sources. [9] The vacuum chamber was evacuated below 10 À4 Pa before processing. After elevating the sample temperature to a holding temperature, Ar plasma was generated for pretreatment to eliminate the surface contaminants or oxides.…”

Section: Plasma Nitridingmentioning

confidence: 99%

Surface Modification of Aluminum Using a Combined Technique of Barrel Nitriding and Plasma Nitriding

Okumiya

Yoshida

Ichiki

et al. 2009

Plasma Processes & Polymers

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In this study, a new nitriding process is proposed to produce the aluminum nitride on the aluminum surface. A process of combined barrel and plasma nitriding techniques was used. By using the barrel nitriding process, an aluminum nitride layer with high thickness can be formed within a matter of hours, and the surface hardness can be improved by using the plasma nitriding. It is suggested that a combined technique of the barrel nitriding and the plasma nitriding is one of the most promising surface treatments for the aluminum.

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New high current low energy ion source

Cited by 67 publications

References 0 publications

Oriented Carbon Nanostructures by Plasma Processing: Recent Advances and Future Challenges

Oriented Carbon Nanostructures by Plasma Processing: Recent Advances and Future Challenges

Deposition of uniform carbon film on silicon substrate by chemical solution process

Surface Modification of Aluminum Using a Combined Technique of Barrel Nitriding and Plasma Nitriding

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