2017
DOI: 10.1016/j.ijheatmasstransfer.2016.10.116
|View full text |Cite
|
Sign up to set email alerts
|

New evaporator structure for micro loop heat pipes

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
8
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
7
1
1

Relationship

0
9

Authors

Journals

citations
Cited by 47 publications
(8 citation statements)
references
References 10 publications
0
8
0
Order By: Relevance
“…The maximum heat load obtained by this LHP was 11 W and the minimum thermal resistance was 1.21 °C/W. This LHP could work under natural convection without any active cooling implemented; start-up stable at a heat load of 2 W. The LHP was made of aluminum and the working fluid was ethanol [68]. The photo of this miniature LHP is presented in Figure 19.…”
Section: Miniature Flat Lhpmentioning
confidence: 99%
“…The maximum heat load obtained by this LHP was 11 W and the minimum thermal resistance was 1.21 °C/W. This LHP could work under natural convection without any active cooling implemented; start-up stable at a heat load of 2 W. The LHP was made of aluminum and the working fluid was ethanol [68]. The photo of this miniature LHP is presented in Figure 19.…”
Section: Miniature Flat Lhpmentioning
confidence: 99%
“…This LHP does not require electric power and features a large heat transfer distance, high heat transfer capacity, and flexible configuration [15,16]. In addition, the ground uses of LHPs for cooling engines and central processing units (CPU) have been proposed [17][18][19]. However, it is difficult for the LHP to cool intense heat sources, such as the electric aircraft's motor, as a result of the insufficient driving force.…”
Section: Introductionmentioning
confidence: 99%
“…Microelectronics technology, which plays a key role in the national economy, military construction, and other fields, is at the core of today's information industry. 1 In recent years, the rapid development of this technology has increasingly tended towards high-frequency, high-speed, miniaturized, and integrated devices. However, this high integration has the unwanted side effect of causing the electronic components to rapidly heat up, which leads to a rise in the working temperature of the equipment.…”
mentioning
confidence: 99%