New CVD Precursors Capable of Depositing Copper Metal under Mixed O₂/Ar Atmosphere.

Abstract

New CVD Precursors Capable of Depositing Copper Metal under Mixed O 2 /ArAtmosphere. -The structure of the Cu complexes (VI) (orthorhombic, space group Pna21, Z = 4) and (VII) (monoclinic, P2/n, 2) are determined by single crystal XRD. CVD experiments show that both complexes are capable of depositing high-quality Cu 0 films at temperatures of 275-300°C using an inert argon carrier gas with low O2 concentrations (2-8%). The best copper thin film showed a purity of ≈96 at.% and a resistivity of 2.1 µΩ·cm (bulk standard 1.7 µΩ·cm). -(LAY, E.; SONG, Y.-H.; CHIU, Y.-C.; LIN, Y.-M.; CHI*, Y.; CARTY, A. J.; PENG, S.-M.; LEE, G.-H.; Inorg. Chem. 44 (2005) 20, 7226-7233; Dep. Chem., Natl. Tsing Hua Univ., Hsinchu 30043, Taiwan; Eng.) -Schramke 50-212

Metal-based Inkjet Inks for Printed Electronics

“…That this is not necessarily the case, was found by Lay et al [190], while studying two new self-reducing partially fluorinated Cu(II) bis(iminoalkoxide) and bis(aminoalkoxide) complexes. 2-8% of O 2 mixed into the Ar carrier gas led to the best results for resistivity and deposition kinetics in the range of 275-300 ºC possibly because oxygen aids the oxidation of ligand fragments during the decomposition process and thus reduces film contamination.…”

Metal–Organic Derivatives with Fluorinated Ligands as Precursors for Inorganic Nanomaterials

“…40 The bridging alkoxide groups are located in both axial and equatorial positions, while the nitrogen atom of the aminoalkoxide group is in the axial position with the N−In−O bond angle to the opposite, axial alkoxide group being 147. A number of other metal complexes (Ti, 70 Zr, 70 Hf, 70 Ru, 39 Pd, 38 Ir, 215 and Cu 37,43 ) based on fluorinated amino-and imino-alkoxide ligands have also been reported. X-ray diffraction studies revealed a monomeric structure in all cases, with the anticipated coordination according to the type of ligand framework.…”

Solid-state thermal degradation behaviour of 1-D coordination polymers of Ni(II) and Cu(II) bridged by conjugated ligand

“…Consequently, the TG curves of 3 and 4 appear to exhibit four steps whereas 2 shows five steps of thermal degradation at a glance. Magnitude of final residue from all the three complexes is higher than that calculated for one mole of metal [28,[29][30][31] probably due to carbonaceous matter alongwith reduced metal. Further, it is worth to be mentioned that rerecorded TG curve of the heterobimetallic complex 4 on simultaneous TGA/DTA-MS device is superimposable on its original TG curve (Fig.…”