2001
DOI: 10.1109/7361.983475
|View full text |Cite
|
Sign up to set email alerts
|

New CMOS-compatible mechanical shear stress sensor

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
2
0
2

Year Published

2001
2001
2013
2013

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 19 publications
(4 citation statements)
references
References 8 publications
0
2
0
2
Order By: Relevance
“…On the contrary the magnetic sensitivity does not depends at all on the orientation of the sensor. As a consequence, when the sensor is rotated by π 2 rad, the sign of V M is inverted while the sign of V H remains constant [26]. Since the roles of the biasing and sensing contacts of a cross-shaped sensor can be inverted, this particular shape allows to take advantage of these properties to remove the parasitic mechanical signal.…”
Section: Offset and Mechanical Sensitivitymentioning
confidence: 99%
“…On the contrary the magnetic sensitivity does not depends at all on the orientation of the sensor. As a consequence, when the sensor is rotated by π 2 rad, the sign of V M is inverted while the sign of V H remains constant [26]. Since the roles of the biasing and sensing contacts of a cross-shaped sensor can be inverted, this particular shape allows to take advantage of these properties to remove the parasitic mechanical signal.…”
Section: Offset and Mechanical Sensitivitymentioning
confidence: 99%
“…Der Geometriefaktor G wurde eingefçhrt, da Kurzschlusseffekte die Empfindlichkeit des Sensors verringern kaennen, wie in [4] erlåutert wird. Der Geometriefaktor ist stets kleiner eins und kann in folgender Weise berechnet werden [7]:…”
Section: Funktionsprinzip Des Sensorsunclassified
“…Eine hochempfindliche Struktur zur Erfassung von Scherspannungen wurde in [4] vorgestellt. Dort wurde der Sensor als Drehmomentsensor eingesetzt.…”
unclassified
“…Several piezoresistive and piezoelectric sensors found in the literature [3,4,5] are sensitive to shear and normal stresses from contact loads (although these sensors generally have ranges and sensitivities more suitable for microscopic phenomena) and may be manufactured with current micromachining technology. The proposed sensor pad is an adaptation of this type of design, modified to be slightly larger and able to accommodate higher contact loads.…”
Section: Design Descriptionmentioning
confidence: 99%