2003
DOI: 10.1016/s0040-6090(03)00955-6
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New challenges on gallium-doped zinc oxide films prepared by r.f. magnetron sputtering

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Cited by 93 publications
(47 citation statements)
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“…On the other hand, the ZGO films are polycrystalline with a preferred (0002) grain orientation and a roughness above 15-18 nm that is enhanced as the annealing temperature increases. This behavior is ascribed to the increase of the crystalline size [15]. Similar results were found for ZnO.…”
Section: Methodssupporting
confidence: 83%
See 1 more Smart Citation
“…On the other hand, the ZGO films are polycrystalline with a preferred (0002) grain orientation and a roughness above 15-18 nm that is enhanced as the annealing temperature increases. This behavior is ascribed to the increase of the crystalline size [15]. Similar results were found for ZnO.…”
Section: Methodssupporting
confidence: 83%
“…Due to cost increase of indium and the need to have films able to sustain a hydrogen plasma discharge during the deposition process [8], zinc aluminum oxide (ZAO) [9][10][11][12][13] and zinc gallium oxide (ZGO) have been developed as a promising alternative to ITO, since zinc (Zn) is a quite abundant (about 10 3 more than In [14]) and "green" material. Besides that, gallium (Ga) has a better doping efficiency than aluminum (Al), allowing room temperature processing [12,15,16]. For these films, the conductivity improvement has been associated with the crystal order and corresponding grain size.…”
mentioning
confidence: 99%
“…[10] These depositions were also carried out at room temperature. Figure 5a shows the source-to-drain current (I DS ) as a function of the gate voltage (V GS ).…”
Section: ±2mentioning
confidence: 99%
“…Gallium is less reactive and more resistant to oxidation compared with aluminium [77,78]. Recently it was demonstrated by the present authors that doping with gallium led to films with low resistivity associated with a high transmittance in the visible region [79][80][81][82][83], even when processed at room temperature. Several techniques have also been used like MOCVD, evaporation, magnetron sputtering, sol gel and plasma assisted molecular beam epitaxy [84].…”
Section: Transparent Oxide Semiconductorsmentioning
confidence: 58%