New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices

Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling

“…The adhesion of material combinations can be measured by Button-Shear-Test (BST) [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] . Fig.…”

“…As shown in Fig. 19, moulding compound 2 lost adhesion to copper substrate due to oxidation at the interface [1].…”

“…Fig. 18 presents the behaviour of maximum shear force average as a function of stress time during a HTS test at 250°C for 2 moulding compounds on copper substrates which have been analysed using BST [1]. As shown in Fig.…”