Neural Network Control of Variable-Frequency Microwave Processing of Polymer Dielectric Curing

Davis, C.; May, G.S.

doi:10.1109/tepm.2008.919345

Cited by 6 publications

(2 citation statements)

References 31 publications

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“…The measured temperature curves do not follow the predicted cure temperature models based on the conventional heating techniques. This can be primarily due to the method used for temperature measurement and also can be due to the low temperature curing capability of the VFM based oven [10].…”

Section: Discussionmentioning

confidence: 99%

“…A microwave heating technique, VFM (Variable Frequency Microwave) has been considered recently for the rapid curing of both conductive and non conductive based polymer dielectrics [7][8][9][10]. The VFM based curing investigations have shown higher cure rates and curing at reduced temperatures as compared with the conventional curing processes [7].…”

Section: Introductionmentioning

confidence: 99%

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Experimental investigation of open-ended microwave oven assisted encapsulation process

Pavuluri

Ferenets

Goussetis

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~ 100% degree of cure

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Experimental investigation of open-ended microwave oven assisted encapsulation process

Pavuluri

Ferenets

Goussetis

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

View full text Add to dashboard Cite

show abstract

Data-Based Online Optimal Temperature Tracking Control in Continuous Microwave Heating System by Adaptive Dynamic Programming

Liu

Liang

Xiong

et al. 2019

Neural Process Lett

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Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator

Pavuluri

Desmulliez

Goussetis

et al. 2011

2011 IEEE 13th Electronics Packaging Technology Conference

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An open-ended single mode resonant microwave applicator has been developed for the curing of encapsulants materials used for microelectronic packaging. Post cure behaviour of Henkel™ E01080 encapsulant material has been studied by Differential Scanning Calorimetry (DSC), Attenuated Total Reflectance Fourier-Transform Infrared (ATR-FTIR) analysis and Dynamic Mechanical Analysis (DMA). DSC based measurement of the microwave cured samples indicates a ~ 99.2% degree of cure and a glass transition temperature, Tg, of 113°C for a sample cured at 150°C for 90 seconds. For the corresponding convection oven cured sample the degree of cure was found to be approximately 70% for the same duration of cure. The ATR-FTIR analysis showed no significant difference between the conventionally and microwave cured samples. Thermal ageing analysis performed on fully conventional and microwave cured samples showed similar ageing behaviour for both samples at a given temperature under Tg

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Neural Network Control of Variable-Frequency Microwave Processing of Polymer Dielectric Curing

Cited by 6 publications

References 31 publications

Experimental investigation of open-ended microwave oven assisted encapsulation process

Experimental investigation of open-ended microwave oven assisted encapsulation process

Data-Based Online Optimal Temperature Tracking Control in Continuous Microwave Heating System by Adaptive Dynamic Programming

Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator

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