2016
DOI: 10.1021/acs.jpcc.6b03963
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Nanoscale Study of the Tarnishing Process in Electron Beam Lithography-Fabricated Silver Nanoparticles for Plasmonic Applications

Abstract: Silver is the ideal material for plasmonics because of its low loss at optical frequencies, though it is often replaced by a lossier metal, gold. This is because of silver’s tendency to tarnish, an effect which is enhanced at the nanoscale due to the large surface-to-volume ratio. Despite chemical tarnishing of Ag nanoparticles (NPs) has been extensively studied for decades, it has not been well understood whether resulted by sulfidation or oxidation processes. This intriguing quest is herein rationalized by s… Show more

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Cited by 52 publications
(51 citation statements)
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“…Silverhasbeenusedinartandjewelleryfor millennia, and it is nowadays ubiquitously adopted for technologically important devices such as catalysts, [1] electric equipment, [2] and localized surface-plasmon nanochips. [3] These applications share ac ommon problem:s ilver corrosion, where the early stage is called tarnishing.A gc orrosion is critical in the electronics industry, [2][3][4] since Ag is used in printed circuit boards (PCBs) as af inish material and both to build electronic components and to assemble them on PCBs. Because PCBs are used in applications where they are exposed to air, Ag-corrosion-related failures are not uncommon [4] and represent an economic burden as well as aperformance and reliability issue.…”
mentioning
confidence: 99%
“…Silverhasbeenusedinartandjewelleryfor millennia, and it is nowadays ubiquitously adopted for technologically important devices such as catalysts, [1] electric equipment, [2] and localized surface-plasmon nanochips. [3] These applications share ac ommon problem:s ilver corrosion, where the early stage is called tarnishing.A gc orrosion is critical in the electronics industry, [2][3][4] since Ag is used in printed circuit boards (PCBs) as af inish material and both to build electronic components and to assemble them on PCBs. Because PCBs are used in applications where they are exposed to air, Ag-corrosion-related failures are not uncommon [4] and represent an economic burden as well as aperformance and reliability issue.…”
mentioning
confidence: 99%
“…To protect the silver nanostructures from oxidizing, a 2 nm thick Al 2 O 3 layer was deposited in a low temperature atomic layer deposition process at 50 °C . Another option to prevent oxidation was to apply a self‐assembled monolayer of hexanethiols …”
Section: Methodsmentioning
confidence: 99%
“…Silver has been used in art and jewellery for millennia, and it is nowadays ubiquitously adopted for technologically important devices such as catalysts, electric equipment, and localized surface‐plasmon nanochips . These applications share a common problem: silver corrosion, where the early stage is called tarnishing.…”
Section: Figurementioning
confidence: 99%
“…These applications share a common problem: silver corrosion, where the early stage is called tarnishing. Ag corrosion is critical in the electronics industry, since Ag is used in printed circuit boards (PCBs) as a finish material and both to build electronic components and to assemble them on PCBs. Because PCBs are used in applications where they are exposed to air, Ag‐corrosion‐related failures are not uncommon and represent an economic burden as well as a performance and reliability issue.…”
Section: Figurementioning
confidence: 99%