Nanoscale investigation of long-term native oxidation of Cu films

Lim, Joo Won; Iijima, Junichi; Zhu, Yongfu; Yoo, Jung Ho; Choi, Good-Sun; Mimura, Kouji; Isshiki, Minoru

doi:10.1016/j.tsf.2007.12.159

Cited by 52 publications

(36 citation statements)

References 19 publications

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“…The oxidation of the formed Cu 2 O film to a CuO film is kinetically limited by the oxygen diffusion through the thin (∼1 nm) CuO surface oxide layer . The CuO layer is too thin to be detected by the XRD, but it is generally agreed that this layer is always present under ambient conditions …”

Section: Influence Of the Reducing Agentsupporting

confidence: 90%

“…[55,56] The CuO layer is too thin to be detected by the XRD, but it is generally agreed that this layer is always present under ambient conditions. [55][56][57][58] 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57…”

Section: Role Of the Reducing Agent And Choice Of Alternativesmentioning

confidence: 99%

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Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition

2020

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Cu2O is attractive as abundant and low‐cost material for energy‐related applications. This study investigated the versatile spray pyrolysis of Cu2O films from aqueous solutions. The appropriate deposition temperature and amount of copper acetate in the sprayed precursor solution was determined in order to eliminate unwanted copper oxide phases. It was shown that the addition of a reducing agent containing primary/secondary OH‐groups with suitable decomposition properties is necessary in order to obtain copper in the +I oxidation state. The influence of the pH value, determined by the addition of acetic acid to solutions containing varying reducing agents, on the structural film properties, was investigated. D‐sorbitol is for the first time proposed as suitable reducing agent to obtain compact and thick (ca. 500 nm) Cu2O films with an optical band gap of 2.3 eV.

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Section: Influence Of the Reducing Agentsupporting

confidence: 90%

Section: Role Of the Reducing Agent And Choice Of Alternativesmentioning

confidence: 99%

Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition

2020

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“…4 indicate similar amount of oxygen content at surfaces (∼45 at.%). The high oxygen content at all sample's surfaces could be caused by exposure of samples in air before the analyses [26][27][28]. Based on (a) all samples have native Cu oxide(s) formed at the surfaces, (b) the sheet resistance ( Fig.…”

Section: Resultsmentioning

confidence: 99%

Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

Hsu¹,

Perng²,

Wang³

2012

Journal of Alloys and Compounds

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“…However, an apparent difficulty with copper is the oxidation of the metal surface [4]. The oxidation of Cu proceeds rapidly even at minimal oxygen partial pressure [20][21][22]. The crucial issue is not only oxidation of the substrate surface, but also diffusion of copper into the other layers [23].…”

Section: Introductionmentioning

confidence: 99%

Growth and Characterisation of Pulsed-Laser Deposited Tin Thin Films on Cube-Textured Copper at Different Temperatures

Szwachta

Gajewska

Kąc

2016

Archives of Metallurgy and Materials

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High-quality titanium nitride thin films have been grown on a cube-textured copper surface via pulsed laser deposition. The growth of TiN thin films has been very sensitive to pre-treatment procedure and substrate temperature. It is difficult to grow heteroexpitaxial TiN films directly on copper tape due to large differences in lattice constants, thermal expansion coefficients of the two materials as well as polycrystalline structure of substrate. The X-Ray diffraction measurement revealed presence of high peaks belonged to TiN(200) and TiN(111) thin films, depending on used etcher of copper surface. The electron diffraction patterns of TiN (200)/Cu films confirmed the single-crystal nature of the films with cube-on-cube epitaxy. The high-resolution microscopy on our films revealed sharp interfaces between copper and titanium nitride with no presence of interfacial reaction.

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Nanoscale investigation of long-term native oxidation of Cu films

Cited by 52 publications

References 19 publications

Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition

Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition

Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

Growth and Characterisation of Pulsed-Laser Deposited Tin Thin Films on Cube-Textured Copper at Different Temperatures

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Nanoscale investigation of long-term native oxidation of Cu films

Cited by 52 publications

References 19 publications

Aqueous Spray Pyrolysis of Cu2O Films: Influence of Reducing Agent and Acetic Acid Addition

Aqueous Spray Pyrolysis of Cu2O Films: Influence of Reducing Agent and Acetic Acid Addition

Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

Growth and Characterisation of Pulsed-Laser Deposited Tin Thin Films on Cube-Textured Copper at Different Temperatures

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Product

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Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition

Aqueous Spray Pyrolysis of Cu₂O Films: Influence of Reducing Agent and Acetic Acid Addition