Nanoscale displacement measurement of electrostatically actuated micro-devices using optical microscopy and digital image correlation

Ya’akobovitz, Assaf; Krylov, Slava; Hanein, Yael

doi:10.1016/j.sna.2010.05.014

Cited by 37 publications

(17 citation statements)

References 57 publications

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“…According to Jin et al [117], the mechanical properties of the electrodeposited nickel-based specimens at the micro-scale level were effectively determined with a combination of SEM imaging and DIC technique. In addition, Ya'akobovitz et al [118] proved that the nanoscale displacement of as much as 100 nm could be accurately determined using the DIC technique. Based on this trend, together with the technological progress in imaging systems, the 2D-DIC technique will soon become an effective tool for the nanoscale deformation measurement.…”

Section: Applications Of Digital Image Correlation In Two-dimensionalmentioning

confidence: 99%

A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

Khoo¹,

Karuppanan²,

Tan³

2016

Metrology and Measurement Systems

101

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Among the full-field optical measurement methods, the Digital Image Correlation (DIC) is one of the techniques which has been given particular attention. Technically, the DIC technique refers to a non-contact strain measurement method that mathematically compares the grey intensity changes of the images captured at two different states: before and after deformation. The measurement can be performed by numerically calculating the displacement of speckles which are deposited on the top of object's surface. In this paper, the Two-Dimensional Digital Image Correlation (2D-DIC) is presented and its fundamental concepts are discussed. Next, the development of the 2D-DIC algorithms in the past 33 years is reviewed systematically. The improvement of 2D-DIC algorithms is presented with respect to two distinct aspects: their computation efficiency and measurement accuracy. Furthermore, analysis of the 2D-DIC accuracy is included, followed by a review of the DIC applications for two-dimensional measurements.

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Section: Applications Of Digital Image Correlation In Two-dimensionalmentioning

confidence: 99%

A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

Khoo¹,

Karuppanan²,

Tan³

2016

Metrology and Measurement Systems

101

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“…Widely used is digital image correlation [8], [9], a method that has been investigated thoroughly by Davis & Freeman [10]. Guo et al [11] use a similar technique based on optical flow: a mathematical concept that formalizes the concept difference between two images in terms of motion, which can be calculated using image correlation.…”

Section: B In-plane Motion Detection Techniques Circumventing the Rementioning

confidence: 99%

In-Plane Displacement Detection With Picometer Accuracy on a Conventional Microscope

Kokorian

Buja

Spengen

2015

J. Microelectromech. Syst.

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Abstract-In this paper, we present a new method for detecting in-plane displacements in microelectromechanical systems (MEMS) with an unprecedented sub-ångström accuracy. We use a curve-fitting method that is commonly employed in spectroscopy to find peak positions in a spectrum. We fit a function to the intensity profile of the image of a silicon beam that was captured with a CCD camera on an optical microscope. The position resolution depends on the amount of pixel noise and on how the moving feature is spread across the detector pixels. The resolution is usually limited by photon shot noise, which can be controlled and lowered in several ways. To demonstrate the technique we measure the adhesion snap-off of two silicon surfaces. We assess the accuracy of the technique using two different silicon MEMS devices and an experimental ultrananocrystalline diamond device. The lowest position noise that we report is obtained by summing 1 577 image lines and is as low as 60 pm root mean square.[ 2014-0040]Index Terms-Displacement measurement, optical noise, optical image processing, optical position measurement, MEMS, subpixel resolution.

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“…Simple displacement tracking of the gauge end has been done with high resolution displacement measurement techniques e.g. SEM [22], digital image tracking (DIT) of light microscopy images [85][86][87] and Fourier analysis of light microscopy images of displaced periodic structures [88]. Digital image tracking can be applied to both SEM and LM images to yield a precision of << 0.1 pixel [84].…”

Section: Displacement Measurementmentioning

confidence: 99%

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

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Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

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Nanoscale displacement measurement of electrostatically actuated micro-devices using optical microscopy and digital image correlation

Cited by 37 publications

References 57 publications

A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

In-Plane Displacement Detection With Picometer Accuracy on a Conventional Microscope

On-wafer time-dependent high reproducibility nano-force tensile testing

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