Nanopackaging: Nanotechnologies and Electronics Packaging

Abstract

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Surface‐Mediated Interconnections of Nanoparticles in Cellulosic Fibrous Materials toward 3D Sensors

“…[ 4,5 ] On the large‐scale and high‐volume printing potential, such printed electronics are expected to enable wearable and portable devices, with a wide range of applications ranging from sensors, displays, solar cells, and other electronic circuits. [ 6–9 ] On the small scales, there were some successful demonstrations of atomic/nanoscale creation of conductive traces that have been reported by use of scanning probe microscopes under extremely low temperature, [ 10,11 ] ultrahigh vacuum conditions, [ 12 ] precision positioning of carbon nanotubes, [ 13 ] or physical or chemical atomic layer deposition. [ 14 ] All these approaches are however unlikely scalable for manufacturing sensor substrates using temperature‐sensitive fibrous materials.…”

Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale

“…Recently, wafer bonding has gained remarkable attention for creating nanoscale devices such as carbon nanotube (CNT) based MEMS (i.e. microcoolers) [2] and ordered templates to realize self-assembly of molecules, nanowires (NWs) or quantum dots (QDs) [3,4]. To bond these nanostructures (i.e., CNTs, NWs, QDs), current wafer bonding methods utilize wet chemical processes, high temperature annealing steps and external forces to achieve high bonding strength.…”

Carbon Nanotubes Interconnects for Nanoelectronics Circuits

“…Recently the CNTs have been proposed as material for nanopackaging interconnects, since their unique electrical, mechanical and thermal properties allows meeting many of the new requirements for bonding, molding compound, underfill, thermal interface, die attach (Morris, 2008;Maffucci, 2009). One of the main reasons pushing towards the use of CNTs in nanopackaging is the possibility either to achieve good electrical performances and implement new heat removal technologies.…”