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2017
DOI: 10.1109/jmems.2017.2764322
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Nanometer-Thin Pure Boron Layers as Mask for Silicon Micromachining

Abstract: The properties of nanometer-thin pure boron layers deposited by chemical vapor deposition were investigated for use as a barrier against tetramethyl ammonium hydroxide (TMAH) and potassium hydroxide (KOH) etching of Si. Deposition temperatures of 400 °C and 700 °C were applied to form layers of a few nanometer thick. Down to 2-nm thickness, they were all found to be resistant to these wet Si etchants. Patterning of the layers was achieved with resist masking and standard aluminum wetetchant. The selectivity to… Show more

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Cited by 16 publications
(25 citation statements)
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“…This section gives a review, based on the reference [43] that was published as part of the present thesis research, of the properties of boron layers that are known from earlier work on PureB diode fabrication. So far, the 400℃ and 700℃ depositions in the Epsilon reactor have been the most interesting layers for electrical applications.…”
Section: Boron Layer Deposited At 400℃ or 700℃mentioning
confidence: 99%
See 4 more Smart Citations
“…This section gives a review, based on the reference [43] that was published as part of the present thesis research, of the properties of boron layers that are known from earlier work on PureB diode fabrication. So far, the 400℃ and 700℃ depositions in the Epsilon reactor have been the most interesting layers for electrical applications.…”
Section: Boron Layer Deposited At 400℃ or 700℃mentioning
confidence: 99%
“…In Fig. 2.5 [43] the main structural and electrical differences between the layers are illustrated. Both layers were deposited in the ASM Epsilon CVD reactor.…”
Section: Boron Layer Deposited At 400℃ or 700℃mentioning
confidence: 99%
See 3 more Smart Citations