Nanomechanical characterizations of metals and thin films

Göken, Mathias; Kempf, M.; Bordenet, M.; Vehoff, H.

doi:10.1002/(sici)1096-9918(199905/06)27:5/6<302::aid-sia503>3.0.co;2-d

Cited by 44 publications

(22 citation statements)

References 16 publications

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“…13 Nanoindentation experiments have been used to get reference values for the elastic stiffness of the sample films, which can be compared to the bulge test results. The measurements have been performed in a nanoindenting atomic force microscope (NI-AFM; Hysitron TriboScope system, Hysitron, Inc., Minneapolis, MN).…”

Section: Nanoindentationmentioning

confidence: 99%

In situ bulge testing in an atomic force microscope: Microdeformation experiments of thin film membranes

Schweitzer

Göken

2007

J. Mater. Res.

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A new bulge testing setup for the measurement of the mechanical properties of thin films is presented. This self-built device can be incorporated in an atomic force microscope (AFM), which allows the recording of topographic images of the observed sample membranes under load conditions. Bulge test experiments on different silicon nitride films are presented and compared to nanoindentation experiments. The measured elastic moduli from nanoindentation and bulge testing are in good agreement. Apart from that, the ability to extract stress-strain data from AFM scans is shown, and the results are compared to standard bulge testing experiments. Imaging of the sample microstructure under load conditions is demonstrated on a thin Cu film.

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Section: Nanoindentationmentioning

confidence: 99%

In situ bulge testing in an atomic force microscope: Microdeformation experiments of thin film membranes

Schweitzer

Göken

2007

J. Mater. Res.

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“…In other studies, [61][62][63][68][69][70][71][72][73][74] researchers have used a Berkovich indenter to measure the local hardness in the grain boundary region as a function of distance from the grain boundary. In general, most of these measurements show an increase in hardness in the vicinity of the grain boundaries (up to 30%) compared to the grain interiors.…”

Section: Grain/phase Boundaries In Metalsmentioning

confidence: 98%

“…Interestingly, two of the studies did not report any significant changes in the hardness across the grain boundary. 68,69 As discussed earlier, hardness defined in these protocols corresponds to an indentation plastic flow stress at a finite, but nonstandardized, value of the indentation plastic strain. Consequently, one should only use the hardness measures as qualitative comparisons.…”

Section: Grain/phase Boundaries In Metalsmentioning

confidence: 99%

Mechanical Characterization of Mesoscale Interfaces Using Indentation Techniques

Kalidindi

Mohan

Rossi

2016

JOM

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Mesoscale interfaces and interphases play a central role in controlling the many macroscale mechanical properties and performance characteristics of structural materials. Modern instrumented indenters present an unprecedented opportunity to measure, reliably and consistently, the local mechanical responses at a multitude of length scales ranging from tens of nanometers to hundreds of microns. When these high-fidelity measurements are combined with rigorous data analyses protocols, it is possible to systematically study the mechanical role of individual mesoscale interfaces and quantify their contributions to the overall mechanical response of the material system. The advantages of these new measurement and analyses protocols as well as the potential for development and implementation of novel high-throughput assays is discussed.

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“…Although the average values are consistent with published values, the metals have rather large variation in their moduli. The large variation is primarily due to surface roughness and pop-in events associated with the indention of thin metal films [5].…”

Section: Materials Characterizationmentioning

confidence: 99%

Thermomechanical modeling of back-end-of-the-line 3D interconnects

Massad

Bauer

Shindé

2009

2009 59th Electronic Components and Technology Conference

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Three-dimensional (3D) integrated circuits (ICs) offer considerable advantages over traditional 2D IC designs by offering increased signal speeds and lower operation power, and by combining multiple technology functions in a lowvolume, stacked design. The design complexity of 3D ICs introduces an increased sensitivity of operation and reliability due to the thermomechanical interactions among their multilevel components. Therefore, physical modeling has become a critical task in the design phase of 3D ICs to manage and reduce these sensitivities, and to increase yield and reliability. In this paper, we develop and employ a high-fidelity, 3D finite element modeling framework to examine the thermomechanical response of 3D IC interconnects. We demonstrate attributes of our framework on a back-end-ofthe-line via chain. First, we generate geometry using process definitions, develop a parameterized mesh, and identify material parameters from characterization experiments. Then, using advanced, massively parallel computational resources, we simulate fabrication steps to approximate the stresses and deformations experienced by the microstructure as a result of processing temperatures. Ultimately, our modeling approach provides a capability to assess the thermomechanical response of 3D IC components and provides a basis for designing structures robust to fabrication and processing variations. IntroductionThree-dimensional (3D) integrated circuits (ICs) offer considerable advantages by offering increased signal speeds and lower operation power, and by combining multiple technology functions in a low-volume stacked design. Threedimensional integration increases the number of potential inter-chip interconnections while reducing interconnection complexity and cost. The design complexity of 3D ICs introduces an increased sensitivity of operation and reliability due to the thermomechanical interactions among their multilevel components [29]. Therefore, mechanical modeling has become a critical consideration in the design phase of 3D ICs to manage and reduce these sensitivities, and to increase yield and reliability [12,14,31]. Progress has been made in the simulation of the thermomechanical response of 3D ICs, primarily utilizing finite element methods in two and three dimensions [2,3,6,8,18].In this paper, we develop and employ a high-fidelity, 3D finite element modeling framework to examine the thermomechanical response of 3D IC interconnects. The modeling process involves three primary steps. In the first, we generate a highly detailed, parameterized geometrical representation of the structure. To accommodate all design features, we use the design layout files and process definitions

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Nanomechanical characterizations of metals and thin films

Cited by 44 publications

References 16 publications

In situ bulge testing in an atomic force microscope: Microdeformation experiments of thin film membranes

In situ bulge testing in an atomic force microscope: Microdeformation experiments of thin film membranes

Mechanical Characterization of Mesoscale Interfaces Using Indentation Techniques

Thermomechanical modeling of back-end-of-the-line 3D interconnects

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