2005
DOI: 10.1007/s00419-005-0394-5
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Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?

Abstract: In what follows we determine the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Additionally, we try to answer the question of whether nanoindentation can be used to quantify the growth of intermetallic phases, in particular at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed and their influence on mechanical properties will be examined. Finite element (FE) s… Show more

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Cited by 31 publications
(19 citation statements)
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References 11 publications
(13 reference statements)
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“…[8] To decrease the computing costs, the simplified 2D axisymmetric model of the nanoindentation test was considered and the Berkovich indenter was treated as a conical one. Such simplified model does not cause a loss of important information, which was validated through the full 3D FEM simulation of nanoindentation tests [1,4]. The results of comparison of 2D simulation and the full 3D model, obtained by the authors of the present work are shown in Fig.…”
Section: Fem Modelmentioning
confidence: 79%
“…[8] To decrease the computing costs, the simplified 2D axisymmetric model of the nanoindentation test was considered and the Berkovich indenter was treated as a conical one. Such simplified model does not cause a loss of important information, which was validated through the full 3D FEM simulation of nanoindentation tests [1,4]. The results of comparison of 2D simulation and the full 3D model, obtained by the authors of the present work are shown in Fig.…”
Section: Fem Modelmentioning
confidence: 79%
“…The constitution of evaporated films was employed with corresponding adjustment in weight percent of the composition, Ag at 50%, Sn at 45%, Cu at 5%. A large quantity of Ag was used for the positive formation of Ag 3 Sn with the lower elastic modulus than those of Cu-Sn IMCs [11,12]. For the inhibition of formation of Cu-Sn IMCs, a small quantity of Cu was added into the evaporated film.…”
Section: Methodsmentioning
confidence: 99%
“…In contrast, thermal stress generated in the IMC joint would be difficult to relax because the IMCs have higher elastic modulus and hardness than those of Pb-based solders [11][12][13][14][15]. A finite element analysis (FEA) was performed to estimate the thermal stress effect under cooling process.…”
Section: Introductionmentioning
confidence: 99%
“…Using the Von Mises yield criterion, one can find the relationship between s max and the yield stress, r y [26,38] : …”
Section: Principle Of Nano-indentationmentioning
confidence: 99%