“…However, DIW and FDM lack the precision of microflow control systems, compromising the accuracy and speed of formation. ,, The optical curing technology through digital chip control, such as digital light processing (DLP) optical curing technology, enables curing layer-by-layer by forming a resin between layers, facilitating high-speed complex compositions. , Currently available curing and forming methods produce weak/less stretching sensors . A flexible strain sensor requires reliable mechanical strength and sensing performance. , The human skin-like stretching strain of 25%, the amount of Young’s module of human skin is 25–220 kPa. , The elastic materials, polyurethane, hydrogel, , silicon, , etc., are commonly used for curing. Among them, polyurethane exhibits high performance due to the hydrogen bonds between polyurethane chains .…”