Nano particles’ behavior in non-Newtonian slurry in mechanical process of CMP

Abstract

Thin fluid film is thought to be formed between the wafer surface and the pad asperity. Hydrodynamic pressure on the surface asperity is periodically generated when particles are passing through it. Fatigue fracture occurs under the effect of periodic pressure, and the fatigue begins from the top to the bottom of the asperity. The removal rate is calculated based on the energy-balance fracture theory. Particle size and its relative velocity are important parameters that affect the polishing effect. Using the multiphase model and the power-law viscosity model of the slurry, particle's velocity and its distribution in the slurry are numerically calculated. The results indicate that the slurry film thickness needs to be in the same order of the particle size that the particle can generate effective hydrodynamic pressure to remove the asperity materials.

A practical prescreening method for sloshing severity evaluation

“…In this paper, a higher-order boundary element method is used, so the solid angle coefficient changes with the shape of the body surface. It can be determined by a direct method (Teng et al 2006). Sloshing-induced force and moment can be obtained by:…”

Analysis of Feature-Scale Wear in Chemical Mechanical Polishing: Modeling and Experiments

“…Most assumed that the sample and the polishing pad are fully separated by a layer of slurry film, as discussed in the review by Terrell and Higgs [1]. A few studies have also analyzed the motion and effects of the abrasive particles in the slurry during CMP, using both statistical [2] and Lagrangian-tracking [3,4] approaches.…”

Computational analysis and chemical mechanical polishing for manufacturing of optical components

“…Their results have shown that the particle size increasing resulted in the increasing of surface roughness. [40] to multiphase 2D model which included particles [94,95]. Some approaches in three-dimensional (3D) CFD models were applied to estimate the non-uniformity and MRR [20].…”