Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Lu, Pai; Øhlckers, Per; Müller, Lucas O.; Leopold, Steffen; Hoffmann, Martin; Grigoras, Kestutis; Ahopelto, Jouni; Prunnila, Mika; Chen, Xuyuan

doi:10.1016/j.elecom.2016.07.002

Cited by 47 publications

(33 citation statements)

References 44 publications

(42 reference statements)

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“…The electrode retained ∼48 % of its capacitance when extending the CV scan rate from 0.1 V s −1 to 10 V s −1 regardless of the electrolyte (Figure b), indicating an excellent rate capability of the sputtered TiN electrode. These CV sweeping rates are significantly higher than the previously reported TiN‐based electrodes,,,, and TiN thin film as electrode sputtered on other substrates,,. The high‐rate performance was also observed in GCD test (Fig.…”

Section: Resultsmentioning

confidence: 60%

“…Interestingly, this finding is contradictory to those who reported a 28 % capacitance retention after 400 cycles and an 88 % retention after 500 cycles in alkaline, specifically KOH electrolytes. The outstanding stability in this study may be due to several factors, including good adhesion of the Cr/CrN interlayer to the sputtered TiN film as well as a reduction in the number of structural failures caused by irreversible oxidation and imperfect crystallinity of TiN ,. Moreover, line‐of‐sight techniques like reactive sputtering can produce homogenous TiN layers at controlled rates, while the vacuum and plasma environment can eliminate the influences of contamination and further provide passivation via plasma‐enhanced CVD on the interior surfaces of the Ti foam.…”

Section: Resultsmentioning

confidence: 98%

“…In this study, we demonstrate a TiN film on three‐dimensional (3D) commercialized titanium (Ti) foams as electrodes for ECs synthesized by reactive physical vapor deposition (PVD), of which the 3D structure is expected to enhance the performance of ECs by facilitating more surface charge/ion storage ,. Other chemical vapor deposition (CVD) or solution‐based TiN synthesis methods may use TiO 2 /NH 3 ,, or TiCl 4 /NH 3 , as precursors, which may introduce impurities causing imperfect crystallinity and inducing structural collapse. By contrast, PVD can achieve one‐step electrode preparation under a high vacuum plasma conditions without the need for any binders or high‐temperature processing.…”

Section: Introductionmentioning

confidence: 99%

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Sputtered Titanium Nitride Films on Titanium Foam Substrates as Electrodes for High‐Power Electrochemical Capacitors

Zheng

Tahmasebi

et al. 2018

ChemElectroChem

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Electrochemical capacitors (ECs) with high‐power capabilities and stable cycling can effectively improve the state of the art in power delivery and energy storage. In this study, we investigate reactively sputtered titanium nitride (TiN) electrodes on three‐dimensional (3D) substrates with various electrolytes and high‐rate cycling conditions. The electrode exhibits cycling stability with negligible capacitance fading after 5 000 cycles and a great rate capability, allowing the (dis)charge rate to extend from 0.1 to 10 V s−1 and retaining nearly 50 % of the capacitance in a three‐electrode system. A symmetric device made with such electrodes is capable of working at a scan rate up to 100 V s−1, yielding a remarkable power density of 4.81×105 W kg−1 at 1.60 Wh kg−1. The energy density can be pushed to 168.03 Wh kg−1 at 4.03×104 W kg−1 by replacing the aqueous electrolyte with an organic one, and this can likely be further increased by electrolyte optimization. The material synthesis and device processing suggest that 3D TiN structures can enable a new class of high‐power ECs with enhanced stability compared to their carbon‐ and pseudo‐ counterparts.

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Section: Resultsmentioning

confidence: 60%

Section: Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

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Sputtered Titanium Nitride Films on Titanium Foam Substrates as Electrodes for High‐Power Electrochemical Capacitors

Zheng

Tahmasebi

et al. 2018

ChemElectroChem

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“…Then the microfabrication techniques are utilized for construction. For instance, bulk silicon was chemically etched by reactive ion etching (RIE), inductive couple plasma etching (ICP) to form microrods and nanowires arrays . Moreover, SiNWs can be produced via hot wire chemical vapor processing at low temperatures, which opens up the possibility of fabrication of MSCs directly on flexible substrates .…”

Section: Fabrication Methodsmentioning

confidence: 99%

On‐Chip Microsupercapacitors: From Material to Fabrication

Wang

Zhang

2019

Energy Tech

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Microsupercapacitors (MSCs) are integrated into microdevices or chip‐based systems to store energy and power the chip efficiently, as they present excellent performance capabilities including high power density, fast charge/discharge rate, and long cycle time. Providing sufficient surface area and high electric conductivity are effective ways to enhance ion diffusion and charge transportation in electrodes, which in turn leads to high performance behavior. Herein, the novel progress of on‐chip MSCs in the past few years ranging from active materials synthesis to high‐resolution fabrication techniques is summarized, and the strategies to enhance the performance of MSCs are focused upon. From conventional materials to nanocomposite hybrid structures, the main active materials for MSC electrodes and the related fabrication techniques are reviewed in detail according to their different electrochemical performance. It is concluded that hierarchical porous‐structured materials and high‐resolution fabrication processes are of great importance in constructing high‐performance devices, which also demonstrates the future developing direction of on‐chip energy devices. The new developments of fabrication technologies such as microfabrication, laser direct writing, and inkjet printing are also discussed to show their advantages in forming high‐performance electrodes.

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“…The main purpose of applying SiC coating technology as protective layer to the surface coated is to increase the lifetime or the performance when it is visible to aggressive environments. The very strong covalent bond between silicon and carbon and its tetrahedral synchronization is the satisfactory explanation to achieve the main purpose [18][19][20]. However, solid adhesion to the substrate and low density of holes and cracks must be obeyed to achieve excellent protective layer.…”

Section: Introductionmentioning

confidence: 99%

Corrosion behavior and resistance parameters of silicon carbide nanocomposite coating on different metals

Suriani¹,

Nik²,

Mansor³

et al. 2018

J. MECH. ENG. SCI.

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Silicon carbide (SiC) films were deposited on stainless steel (SS), mild steel (MS) and aluminium (Al) from a SiC targeted in a magnetron sputtering system to produce the amorphous SiC coating. Magnetron sputtering is a Physical Vapor Deposition process for deposited material onto substrate by ejecting atom from such SiC and condensing the ejected atom onto SS, MS and Al metals in high vacuum environment. The behavior of the films as corrosion protection barriers in different concentrations of sodium chloride (NaCl) solution in 0.5 M and 1.0 M at different temperatures (30 o C and 50 o C) were evaluated by electrochemical impedance spectroscopy (EIS) measurements. Films on SS exhibited a better corrosion resistance than MS and Al. The weight loss measurement, it shows that uncoated metals loss more weight than coated metals for longer time of immersion. Meanwhile the EIS results also depicted that the polarization resistance, (R p) coated metals indicates higher value compared to uncoated metals. The water salinity and temperatures also showed a significant effect on polarization resistance, (R p ) for both coated and uncoated metals. The R p are decreased with the increased of salinity and temperature accordingly. X-ray diffraction (XRD) used for determination of phase identification. Based on XRD, there are no higher peaks were obtained on SiC, and showed that SiC were confirmed amorphous. It concluded that this study shows corrosion rate of coated metals was decreased obviously compared to uncoated metals and SiC nanocomposite coating performed a significant corrosion behaviors and resistance parameter on different metals.

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Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Cited by 47 publications

References 44 publications

Sputtered Titanium Nitride Films on Titanium Foam Substrates as Electrodes for High‐Power Electrochemical Capacitors

Sputtered Titanium Nitride Films on Titanium Foam Substrates as Electrodes for High‐Power Electrochemical Capacitors

On‐Chip Microsupercapacitors: From Material to Fabrication

Corrosion behavior and resistance parameters of silicon carbide nanocomposite coating on different metals

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