Nano-Bio- Electronic, Photonic and MEMS Packaging 2009
DOI: 10.1007/978-1-4419-0040-1_2
|View full text |Cite
|
Sign up to set email alerts
|

Nano-conductive Adhesives for Nano-electronics Interconnection

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
13
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
5
2
2

Relationship

0
9

Authors

Journals

citations
Cited by 25 publications
(16 citation statements)
references
References 63 publications
0
13
0
Order By: Relevance
“…A direct attachment of the IC with electrically conductive adhesive (ECA) bonding would probably be ideal because of a low-temperature process and low cost. In the future, the attachment of the IC could be also done directly by inkjet-printing the adhesive on the tag antenna's IC pads as jettable ECAs become available [19].…”
Section: E Embedding Rfid Tags Into Plywood Using Direct Inkjet-prinmentioning
confidence: 99%
“…A direct attachment of the IC with electrically conductive adhesive (ECA) bonding would probably be ideal because of a low-temperature process and low cost. In the future, the attachment of the IC could be also done directly by inkjet-printing the adhesive on the tag antenna's IC pads as jettable ECAs become available [19].…”
Section: E Embedding Rfid Tags Into Plywood Using Direct Inkjet-prinmentioning
confidence: 99%
“…Inevitably, failure probabilities increase if devices are not consistently maintained and repaired [1][2][3]. For mass produced miniaturized electronic components, the high cost, difficulty, or even impossibility of repair justify research concerning materials capable of 'self-healing' upon the occurrence of damage [4][5][6][7]. Thus, the goal of this research is to fabricate materials commonly used in microelectronics possessing the ability to automatically recover their original functionality much like wound healing within a biological system [3,[8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…Electrically conductive epoxies (ECAs) are often used as external coatings, 'bulk' packaging materials or as interconnects for electronic devices [12][13][14][15][16]. Thermoset epoxies are commonly chosen due to their relevant properties, such as excellent adhesive strength, good chemical and corrosion resistance, and low cost [6,[16][17][18][19]. Conductive fillers (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…However, lower electrical conductivity, poor impact strength, and decreasing conductivity by humidity aging or normal use condition have been reported in reliability testing using silver paste as compared with tin-lead solder. [17] As it is difficult to use tin-lead soldering in microelectrodes for lead connections, more efforts to develop electrode-lead junctions better than silver pasting are needed. In addition, although the electrode-lead contact resistance caused by connection of microelectrodes to apparatus is also an empirically important factor, there have been few reports on "electrode-lead" contact resistance.…”
Section: Introductionmentioning
confidence: 99%