n-Type Semiconductive Polymer and Poly(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene) Blends for Energy Storage Applications

Abstract

Dielectric polymers play a vital role in modern electronic and electrical application because of easy processing, light weight, and high breakdown strength. A high dielectric constant (εr) and breakdown strength cannot be satisfied simultaneously in the dielectric homopolymers. Via combining the merits of different polymers, the dielectric polymer blending method is a feasible option to address this issue. In this paper, n-type semiconductive polymer poly­(1,6,7,12-tetra-chlorinated perylene-N-2-aminoethyl acrylate-N′-dodecylamine-3,4,9,10-tetracarboxylic bisimide) (PPDI) and relaxor ferroelectric polymer poly­(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene) (PVTC) were utilized to prepare the dielectric polymer blends because PPDI had the characteristic of binding electrons and PVTC possessed a high εr. A series of polymer blends with different weight ratios of PPDI were fabricated to investigate the loading effect of an n-type semiconductive polymer on the dielectric and energy storage properties of PPDI/PVTC blends. The experimental results showed that, when the loading was below 3 wt %, the εr of polymer blends increased from 25 to 33 at 102 Hz with the increasing content of polymer PPDI and then decreased from 33 to 7 with the increasing concentration from 3 to 40 wt %. The dielectric behavior of polymer blends was related to the dispersion of organic fillers and interface polarization. Additionally, a low dielectric loss was found in all polymer blending films. A maximal discharge energy density of 4.42 J/cm–3 was achieved in the 4.5 wt % PPDI/PVTC blending film at 200 kV/mm–1. The finding presents an innovative idea to synthesize high-performance all-organic dielectric materials.

Achieving Superior Energy Storage Properties of All-Organic Dielectric Polystyrene-Based Composites by Blending Rod–Coil Block Copolymers

“…The discharge energy density ( U d ) is obtained based on eq U d = ∫ E d D , and the efficiency (η) is calculated by eq in which U s is the total energy density. − The U d and η values are displayed in Figure according to the P – E hysteresis loops shown in Figure d. As plotted in Figure d, the U d of PS-based blended films gradually increases with the addition of polymer organic fillers.…”

Enhanced crystallization behaviors and dielectric performance of poly(vinylidene fluoride) film induced by polyamide-1

“…The energy storage density of PVDF/PA1 blends increases from 0.89 × 10 À2 J/cm 3 up to 1.16 × 10 À2 J/cm 3 . [43][44]…”

All-Organic Polymer Dielectrics Containing Sulfonyl Dipolar Groups and π–π Stacking Interaction in Side-Chain Architectures

“…5−7 Compared with traditional ceramic dielectric materials and ceramic/polymer composited dielectrics, all-organic polymer dielectric materials are more attractive because of their lightweight, low cost, low dielectric loss (tan δ), and high energy efficiency. 8 However, the relative dielectric constant (ε r ) or permittivity of most commercially available polymers is too low to meet the requirements of high energy density or miniaturization of modern electronic components. 9 In this case, different strategies are carried out to increase the ε r and energy density, such as doping inorganic fillers with high ε r (such as BaTiO 3 ) into the polymer matrix to enhance the ε r , 10−15 improving the interfacial characteristics, e.g., constructing multilayer structure 16−21 or core−shell fillers.…”

“…High-performance dielectric materials are urgently needed for advanced electrical and power applications, such as energy-storage devices − and transistors. − Compared with traditional ceramic dielectric materials and ceramic/polymer composited dielectrics, all-organic polymer dielectric materials are more attractive because of their lightweight, low cost, low dielectric loss (tan δ), and high energy efficiency . However, the relative dielectric constant (ε r ) or permittivity of most commercially available polymers is too low to meet the requirements of high energy density or miniaturization of modern electronic components .…”