Investigations of nitrogen incorporation during film deposition by dc magnetron sputtering with a CrSiAl target in Ar/N, mixtures have been carried out in the range of the metallic mode. The rate of the nitrogen consumption is proportional to the nitrogen partial pressure during deposition and to the amperage. The corresponding rate constant decreases with the argon pressure. Furthermore, the condensation rate of the target species decreases with the nitrogen partial pressure and is determined by the rate constant of the nitrogen consumption. The experimental results are explained by a 4-stepped reaction sequence of nitrogen incorporation consisting in ( I ) ionization, (2) ion bombardment of the target and formation of a coverage by plating, (3) removal of the coverage by the sputter process, (4) condensation on the substrate.