Multiscale analysis of the effect of interfacial thermal conductance between fillers and epoxy resin on the effective thermal conductivity of their composites

Sheng, Can; Liang, Kang; Wu, Gai; Dong, Fang; Guo, Yuzheng; Liu, Sheng

doi:10.1016/j.diamond.2022.109521

Cited by 3 publications

(1 citation statement)

References 41 publications

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“…The thermal conductivity of epoxy resins is as low as ~0.2 W/(m•K) [7]. There have been studies on epoxy-based composites lled with a variety of thermally conductive materials [7,[14][15][16][17][18][19][20][21]. These studies, however, showed that high contents of llers were required to achieve high conductivity.…”

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confidence: 99%

Thermal conductivity of an epoxy resin enhanced with a polythiophene/graphene complex and aluminum nitride

Maruyama,

Tominaga,

Kado

et al. 2023

Preprint

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Thermal management plays an important role in electronic devices as the power density of electronic devices increases year by year. A polymer-composite with thermal conductivity is one of rational approaches for heat dissipation in electronic devices. We prepared epoxy resin-based composite films filled with a polythiophene [poly(3-hexylthiophene-2,5-diyl)]/graphene complex and aluminum nitride (AlN). Electrical resistance measurements indicate that the prepared epoxy films exhibited insulating properties. The composite films were characterized by electron microscopic observation, thermogravimetric analysis and thermal conductivity measurements. The addition of a small quantity of P3HT/graphene complex (< 1 wt%) increased the out-of-plane and in-plane thermal conductivities of the epoxy resin. The addition of AlN also increased the thermal conductivities, but required ≤ 40 wt% to obtain a thermal conductivity comparable with that of a 0.9 wt% P3HT/graphene complex. The present study suggested the high potential of P3HT/graphene complexes as fillers for improving the thermal conductivity of epoxy resins without affecting their insulating properties.

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Section: Full Textmentioning

confidence: 99%

Thermal conductivity of an epoxy resin enhanced with a polythiophene/graphene complex and aluminum nitride

Maruyama,

Tominaga,

Kado

et al. 2023

Preprint

View full text Add to dashboard Cite

show abstract

Thermal conductivity of epoxy resin films doped with a polythiophene/graphene complex or aluminum nitride

Maruyama,

Tominaga,

Kado

et al. 2024

Polymer Composites

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Polymer composites with thermal conductivity are attractive for heat dissipation in electronic devices. We prepared epoxy resin‐based composite films filled with polythiophene [poly(3‐hexylthiophene‐2,5‐diyl)] (P3HT)/graphene complex or aluminum nitride (AlN). The composite films were characterized by electron microscopic observation, thermogravimetric analysis, and thermal conductivity measurements. The addition of a small content of P3HT/graphene complex (<1 wt%) increased both the out‐of‐plane and in‐plane thermal conductivities of the epoxy resin. The addition of AlN also increased thermal conductivity, but ≥40 wt% was required to obtain thermal conductivity comparable with that of an epoxy resin film doped with 0.9 wt% P3HT/graphene complex. The present results illustrate the potential of P3HT/graphene complexes as fillers for improving the thermal conductivity of epoxy resins without affecting their insulating properties.Highlights Polythiophene/graphene fillers increased epoxy resin films' thermal conductivity. To raise the thermal conductivity of epoxy resin films high AlN content was needed. In‐plane/out‐of‐plane epoxy resin films' thermal conductivities were evaluated.

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Investigation of Moisture Influence on Structure and Thermal Conductivity of Epoxy Resin by Molecular Dynamics Simulation

Sheng,

He,

Zhang

et al. 2023

2023 24th International Conference on Electronic Packaging Technology (ICEPT)

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Multiscale analysis of the effect of interfacial thermal conductance between fillers and epoxy resin on the effective thermal conductivity of their composites

Cited by 3 publications

References 41 publications

Thermal conductivity of an epoxy resin enhanced with a polythiophene/graphene complex and aluminum nitride

Thermal conductivity of an epoxy resin enhanced with a polythiophene/graphene complex and aluminum nitride

Thermal conductivity of epoxy resin films doped with a polythiophene/graphene complex or aluminum nitride

Investigation of Moisture Influence on Structure and Thermal Conductivity of Epoxy Resin by Molecular Dynamics Simulation

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