Thermal conductivity of an epoxy resin enhanced with a polythiophene/graphene complex and aluminum nitride

Abstract

Thermal management plays an important role in electronic devices as the power density of electronic devices increases year by year. A polymer-composite with thermal conductivity is one of rational approaches for heat dissipation in electronic devices. We prepared epoxy resin-based composite films filled with a polythiophene [poly(3-hexylthiophene-2,5-diyl)]/graphene complex and aluminum nitride (AlN). Electrical resistance measurements indicate that the prepared epoxy films exhibited insulating properties. The composite films were characterized by electron microscopic observation, thermogravimetric analysis and thermal conductivity measurements. The addition of a small quantity of P3HT/graphene complex (< 1 wt%) increased the out-of-plane and in-plane thermal conductivities of the epoxy resin. The addition of AlN also increased the thermal conductivities, but required ≤ 40 wt% to obtain a thermal conductivity comparable with that of a 0.9 wt% P3HT/graphene complex. The present study suggested the high potential of P3HT/graphene complexes as fillers for improving the thermal conductivity of epoxy resins without affecting their insulating properties.