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2019 IEEE International Electron Devices Meeting (IEDM) 2019
DOI: 10.1109/iedm19573.2019.8993480
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Multiple-Vt Solutions in Nanosheet Technology for High Performance and Low Power Applications

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Cited by 22 publications
(8 citation statements)
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“…Extension work to establish the precise device models for 3D devices such as Fin-FETs [30][31][32] or gate-all-around FETs [33,34] is still outstanding. Even though the device format is multi-nano-sheet (mNS) or multi-bridge-channel [16,[35][36][37], this concept of providing a great set of device models considering the contribution of the gate field is rather feasible. Of course, entering the 10-nm process or beyond, the current performance can be disturbed by quantum confinement effects [38][39][40].…”
Section: Discussionmentioning
confidence: 99%
“…Extension work to establish the precise device models for 3D devices such as Fin-FETs [30][31][32] or gate-all-around FETs [33,34] is still outstanding. Even though the device format is multi-nano-sheet (mNS) or multi-bridge-channel [16,[35][36][37], this concept of providing a great set of device models considering the contribution of the gate field is rather feasible. Of course, entering the 10-nm process or beyond, the current performance can be disturbed by quantum confinement effects [38][39][40].…”
Section: Discussionmentioning
confidence: 99%
“…The most remarkable difference from the LNS is that the thicker epitaxial growth of Si (TSi) is required than that of SiGe (TSiGe) for the formation of the channels [Fig. 3 Additionally, in FNS, the increase of width can be simply implemented by modulating the fin height for the enhanced current as contrast to LNS where it is difficult to increase the width of the nanosheet because it affects multi-Vth process margin by changing the space between nanosheets with different Vth or between NMOS and PMOS [16].…”
Section: Process Flowmentioning
confidence: 99%
“…The mean time to failure decreases as the temperature rises. A close working relationship with a multiple sheet foundry is required for advanced process nodes to meet the foundry's "sign-off" certification requirements using complex EM rules [19].…”
Section: Introductionmentioning
confidence: 99%