2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.268
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Multiphysics Life-Prediction Model Based on Measurements of Polarization Curves for Copper-Aluminum Intermetallics

Pradeep Lall
1
,
Yongchao Luo
2
,
Luu Nguyen
3
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Cited by 7 publications
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References 15 publications
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Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments

Lall
1
,
Deshpande
2
,
Luo
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments

Lall
1
,
Deshpande
2
,
Luo
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
2
0
0
0
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Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test

Lall1,
Luo2,
Nguyen
3
2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
4
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Machine Learning Prediction Model for Automation Equipment Control in Semiconductor Manufacturing

Bakar1
2022
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
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