Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments

This article reviews corrosion in electronic packaging mainly in the semiconductor industry over the world. The previous study was reviewed scientifically to highlight the significant work on corrosion in electronic packaging. A total of 467 and 762 studies were found in the IEEE Explore and Scopus databases from 2010 to 2020, respectively. After the search was limited to articles and proceedings, the databases showed only 319 from IEEE and 694 from Scopus. The keywords searching for this topic also emphasized corrosion wire bonding, corrosion leadframe, and corrosion solder. When searching for articles and proceedings were divided into three (3) categories such as academia, industry, and collaborative works, the database from collaborative works showed only 57 and 108 results in IEEE and Scopus, respectively. The studies were classified according to the process after some analysis using Microsoft Excel. Most of the previous studies were on corrosion in electronic packaging. From the study, we found that most of the journal articles were published by academia while the proceeding was published by industry. This information was extracted from IEEE Explore and Scopus databases. Since 2010, the trend of collaborative works among the industry and academia showed increased from 13 to 165 total publications in 2020. This review is significant to give an overview of the collaborative works between industry and academia on the corrosion issue in electronic packaging.

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Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments

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References 15 publications

Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

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