Multiparallel systolic arrays for multidimensional FFT-architectures on 3D-VLSI

Kühn, Stefan; Kleiner, M.B.; Weber, W.

doi:10.1016/s1383-7621(96)00061-6

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2006

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“…The number of leads between those chips is small (5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20). For each field of application the technical solution may be different.…”

Section: Automotive Backgroundmentioning

confidence: 99%

Three-Dimensional Integration of Silicon Chips for Automotive Applications

Weber

2006

MRS Proc.

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Currently, three-dimensional (3D) integration of semiconductor chips is in the phase of introduction in high-volume products. While memory and communication are the leading fields of application, automotive use requires specific non-standard solutions. Some of these solutions are still being researched or are in development, whereas others are already in production. This paper elaborates on the different opportunities and constraints of automotive applications, presents different technological options, and discusses specific solutions.

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“…The number of leads between those chips is small (5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20). For each field of application the technical solution may be different.…”

Section: Automotive Backgroundmentioning

confidence: 99%

Three-Dimensional Integration of Silicon Chips for Automotive Applications

Weber

2006

MRS Proc.

Self Cite

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show abstract

Multiparallel systolic arrays for multidimensional FFT-architectures on 3D-VLSI

Cited by 1 publication

References 15 publications

Three-Dimensional Integration of Silicon Chips for Automotive Applications

Three-Dimensional Integration of Silicon Chips for Automotive Applications

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