1998
DOI: 10.1063/1.367255
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Multilayer thermionic refrigerator and generator

Abstract: A new method of refrigeration is proposed. Cooling is obtained by thermionic emission of electrons over periodic barriers in a multilayer geometry. These could be either Schottky barriers between metals and semiconductors or else barriers in a semiconductor superlattice. The same device is an efficient power generator. A complete theory is provided.

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Cited by 140 publications
(76 citation statements)
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References 14 publications
(19 reference statements)
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“…8 There is, however, little to distinguish the underlying thermodynamics of the two types of device, with both achieving reversibility under the same conditions 25 and both being governed by the same "materials parameter." 29,30,37 Under the relaxation-time approximation the electric current in a thermoelectric device may be calculated using the Boltzmann transport equation as…”
Section: A Diffusive Transport Theorymentioning
confidence: 99%
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“…8 There is, however, little to distinguish the underlying thermodynamics of the two types of device, with both achieving reversibility under the same conditions 25 and both being governed by the same "materials parameter." 29,30,37 Under the relaxation-time approximation the electric current in a thermoelectric device may be calculated using the Boltzmann transport equation as…”
Section: A Diffusive Transport Theorymentioning
confidence: 99%
“…The potential for achieving lower barrier heights via the use of semiconductor heterostructures was pointed out by Shakouri and Bowers, 5,6 with Mahan et al 7,8 suggesting multilayers as a means of reducing the phonon heat leaks inherent in the use of solidstate rather than vacuum devices. Successful solid-state thermionic cooling of up to a few degrees has been reported.…”
Section: Introductionmentioning
confidence: 99%
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“…Mahan et al later proposed multilayer structures as a way of reducing phonon heat leaks inherent in the use of solid-state rather than vacuum-based devices, thus improving efficiency [7], [8]. Successful solidstate thermionic cooling has been reported by Shakouri et al using a single-barrier InGaAsP based structure [9] and by LaBounty et al using a 25-barrier InGaAsP based multilayer system [10].…”
Section: Introductionmentioning
confidence: 97%
“…The main challenges in designing a practical thermionic device are to maximise the thermal emission of electrons and to minimise the heat backflow due to phonons. Mahan et al [4] proposed using a multibarrier system, reasoning that using N barriers identical to a single barrier would reduce the temperature gradient across each barrier to ∼ ΔT/N, effectively reducing the back-flow by a factor of N . A second advantage of using a multibarrier system stems from experimental work carried out on the thermal conduction of superlattices as compared to bulk materials [5].…”
Section: Introductionmentioning
confidence: 99%