IEEE International Digest on Microwave Symposium
DOI: 10.1109/mwsym.1990.99708
|View full text |Cite
|
Sign up to set email alerts
|

Multilayer MMIC using a 3 mu m*3-layer dielectric film structure

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
29
0

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 89 publications
(29 citation statements)
references
References 3 publications
0
29
0
Order By: Relevance
“…Many circuit miniaturization methods have been proposed to date, including methods using capacitor loading [5,[13][14][15], methods using a meander-like line [2][3][4]16], methods using stubs [17,18], a method using coupled lines [19], and a method using space-filling curves [20]. Hirota and colleagues have proposed a transmission line using a short high-impedance line and two lumped elements (capacitors) [5].…”
Section: Methods For Circuit Miniaturizationmentioning
confidence: 99%
See 4 more Smart Citations
“…Many circuit miniaturization methods have been proposed to date, including methods using capacitor loading [5,[13][14][15], methods using a meander-like line [2][3][4]16], methods using stubs [17,18], a method using coupled lines [19], and a method using space-filling curves [20]. Hirota and colleagues have proposed a transmission line using a short high-impedance line and two lumped elements (capacitors) [5].…”
Section: Methods For Circuit Miniaturizationmentioning
confidence: 99%
“…The meander-like line is also effective for circuit miniaturization [2]. However, in general planar formed MMICs, the line spacing is required to be two to three times the substrate thickness, so that miniaturization is limited.…”
Section: Methods For Circuit Miniaturizationmentioning
confidence: 99%
See 3 more Smart Citations