Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

Iwai, Tsuruji; Sakai, Taiji; Mizutani, Daisuke; Sakuyama, Seiki; Iida, Kenji; Inaba, Takayuki; Fujisaki, Hidehiko; Tamura, Akira; Miyazawa, Yoshinori

doi:10.1109/ectc.2019.00301

Cited by 11 publications

(3 citation statements)

References 6 publications

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“…Moreover, even multilayer glass configurations with stacked TGVs are possible, whose galvanic contacts can be established by Cu/Sn bonding (see Fig. 7(a)) [99] or conductive paste [100].…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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“…Moreover, even multilayer glass configurations with stacked TGVs are possible, whose galvanic contacts can be established by Cu/Sn bonding (see Fig. 7(a)) [99] or conductive paste [100].…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

View full text Add to dashboard Cite

show abstract

“…The resistivity of the filled vias was 2-4 orders of magnitude higher than that of bulk copper. Iwai et al (2018a), Iwai et al (2018b), and Iwai et al (2019) in Fujitsu Laboratory filled TGVs in a multi-layer glass package substrate with copper paste and sintered them by a vacuum hot-pressing machine. The single hole resistance was 5.2 mΩ, and the resistivity was 0.26 μΩ•cm.…”

Section: Microvia Filling Performance Of Metal Nano/ Microparticle Co...mentioning

confidence: 99%

A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

Yang

Luo

et al. 2022

Front. Mater.

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Microvia filling is a core interconnection technique in electronic manufacturing. Electroplating is the primary method used in the industry for filling microvias but also has the drawbacks of cumbersome procedures and toxic by-products. New microvia filling technology through printing of metal particle–based conductive fillers was then developed, with the advantages of simpler process, higher efficiency, better compatibility, and eco-friendliness. Here, we review the up-to-date research findings on the microvia filling technology based on printed metal nano/microparticles from the perspectives of material development and filling performance. Some key questions about this technology are also discussed. We hope the outlook presented by this review could help the further studies on this topic. The review also identifies some key remaining issues to be resolved.

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“…Compared with other metal particle conductive inks with relatively low solid content (40~50 wt.% [ 23 ]), and metal particle conductive adhesives with undecomposable organic additives such as film-forming agents and cross-linking agents [ 24 ], the Cu@Ag particle paste is able to reach better sinterability and conductivity. In terms of filling method, previous studies have tried screen printing [ 25 , 26 , 27 ], squeegee printing [ 28 ], and inkjet printing [ 7 ]. However, the filling performance of these methods are unsatisfactory, as the evaporation of solvents will lead to shrinkage cavities in the structure.…”

Section: Introductionmentioning

confidence: 99%

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

et al. 2022

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In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs. By developing a dense refill method, the porosity of the sintered particles within the microvias was significantly reduced from ~30% to ~10%, and the electrical conductivity is increased about twenty-fold. Combing the Cu@Ag NMPs and the dense refill method, the microvias could obtain resistivities as low as 7.0 and 6.3 μΩ·cm under the sintering temperatures of 220 °C and 260 °C, respectively. The material and method in this study possess great potentials in advanced electronic applications.

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Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

Cited by 11 publications

References 6 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

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