A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

Abstract

In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs. By developing a dense refill method, the porosity of the sintered particles within the microvias was significantly reduced from ~30% to ~10%, and the electrical conductivity is increased about twenty-fold. Combing the Cu@Ag NMPs and the dense refill method, the microvias could obtain resistivities as low as 7.0 and 6.3 μΩ·cm under the sintering temperatures of 220 °C and 260 °C, respectively. The material and method in this study possess great potentials in advanced electronic applications.

Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

“…Similar to Cu, Ag is also an interconnection material with high conductivity and high thermal conductivity. Cu/Ag composites are also often used in semiconductor packaging interconnection [ 9 ], printed circuits [ 10 ] and microvia filling [ 11 ]. Therefore, Ag is used as the pre-filling material in the experimental design of this paper, which meets the requirements of interconnect material performance in the microelectronic packaging process.…”