Multijunction thermal converters by commerical CMOS fabrication

Gaitan, Michael; Suehle, John S.; Kinard, J.R.; Huang, De-Xiang

doi:10.1109/imtc.1993.382642

Cited by 6 publications

(4 citation statements)

References 3 publications

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“…N~Un n=l (3) where Uc is the uncertainty at a particular step in the buildup, N is the number of independent build-up paths, and Un is the standard error of the nth step in the build-up. In this case, N = 2 for the reference set build-up and the working set build-up (measurements using the LFfE4 and LFTE6 TE's in series with working set resistors do not form a continuous build-up path).…”

Section: In Resultsanduncertainty Calculationsmentioning

confidence: 99%

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A reevaluation of the NIST low-frequency standards for AC-DC difference in the voltage range 0.6-100 V

Lipe

1996

IEEE Trans. Instrum. Meas.

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A reevaluation of the NIST standards of ac-dc difference was undertaken in an effort to reduce the calibration uncertainty offered by NIST for thermal voltage converters (TVC's) at frequencies below 100 Hz. This paper describes the measurements taken in support of this effort, as well as the devices used for the reevaluation process and the analysis of the uncertainty of the measurements. This reevaluation of the NIST low-frequency standards will permit a significant reduction in uncertainty for ac-dc difference calibrations at 10 Hz in the voltage range from 0.6-100 V.

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Section: In Resultsanduncertainty Calculationsmentioning

confidence: 99%

“…Traditional vacuum-bulb thermoelements have heater lengths of about 0.8 cm and cease thermal averaging at about 20-30 Hz [1]. Thin film devices [2], [3], however, may have time constants on the order of a few milliseconds and may cease thermal averaging at frequencies as high as 100 Hz or more.…”

Section: = Va-vdmentioning

confidence: 99%

A reevaluation of the NIST low-frequency standards for AC-DC difference in the voltage range 0.6-100 V

Lipe

1996

IEEE Trans. Instrum. Meas.

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“…Micromachined devices such as microheating elements [1], thermal converters [2,3], thermistors [4], thermal sensors, gas sensors [5] have been developed using commercial CMOS process. Considerable research has been done on micromachined devices for various applications like detection of flammable and toxic gases, gas flow sensors etc.…”

Section: Introductionmentioning

confidence: 99%

Design, fabrication, and testing of polysilicon microheaters in silicon

George¹,

Srivastava

1996

Microlithography and Metrology in Micromachining II

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We report the technology for the design, fabrication and testing of polysilicon microheaters in silicon using a standard 2 m n-well CMOS technology. The polysilicon microheaters are realized in two steps : layout design for CMOS process and post processing etching. An additional layer in CMOS technology called "open" was incorporated. The "open" layer creates a direct opening to the substrate. Post processing is done on the fabricated CMOS chips using isotropic etchant like xenon diflouride (XeF2) or anisotropic etchant like ethylenediamine pyrocatechol (EDP) to create a "cavity" in the silicon substrate. The cavity provides thermal isolation from the polysilicon microheaters to the circuits and other devices. These microheaters can reach incandescence at very low power. Several test devices incorporating arrays of polysilicon microheaters were designed and fabricated. Measurements are presented that verify the design and performance ofthe microheater.

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“…M. Gaitin of the NIST Semiconductor Electronics Division, using CMOS-foundry compatible micromachining[7],[8]. The CMOS-foundry compatible micromachining technique is based on the incorporation of open areas in the mask layout.…”

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confidence: 99%

Development of thin-film multijunction thermal converters at NIST

Kinard

Novotny²,

Lipe

et al. 1997

IEEE Trans. Instrum. Meas.

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This paper gives an overview of the development of thin-film multijunction thermal converters (FMJTC's) at the National Institute of Standards and Technology (NIST). A historical perspective of film thermal converters is presented, followed by descriptions of the motivation, fabrication processes, physical characteristics, and the electrical properties of the FMJTC's produced at NIST. Integrated micropotentiometers that incorporate FMJTC's and thermal converters, produced by an alternative fabrication technology using a CMOS foundry, are also described. The paper concludes with a report on the present status of the FMJTC project and future directions.

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Multijunction thermal converters by commerical CMOS fabrication

Cited by 6 publications

References 3 publications

A reevaluation of the NIST low-frequency standards for AC-DC difference in the voltage range 0.6-100 V

A reevaluation of the NIST low-frequency standards for AC-DC difference in the voltage range 0.6-100 V

Design, fabrication, and testing of polysilicon microheaters in silicon

Development of thin-film multijunction thermal converters at NIST

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