“…As we all know, a typical field-effect transistor (FET) is usually composed of gate electrodes, dielectrics, active layers, and drain and source electrodes . Thereinto, metal electrodes and inorganic dielectrics are commonly prepared using high-energy preparation techniques, such as vacuum thermal evaporation, ,,,, e-beam evaporation, ,,, atomic layer deposition, ,, and so on. In general, high-energy atoms or atomic clusters will repeatedly bomb the contact area, resulting in many interface damage, defects, and surface states at the interface between metal and semiconductor, which will further affect the injection and transport of charge carriers .…”