Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate

Yamanaka, Naoaki; Kikuchi, S.; Kon, T.; Ohsaki, T.

doi:10.1109/ectc.1990.122244

Cited by 26 publications

(7 citation statements)

References 8 publications

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“…A multichip module [3] has been proposed for improving the performance of communication systems. The high packaging density of an MCM will decrease signal propagation delay as well as electromagnetic emission.…”

Section: Experimental Apparatus and Proceduresmentioning

confidence: 99%

“…Correspondingly, the heat ux in a B-ISDN is one or two orders of magnitude higher than in conventional systems, and will reach 1-2 W/cm 2 , which will necessitate new packaging systems and ingenious cooling technology [1,2]. The multichip module (MCM) has been considered [3] an appropriate packaging design for B-ISDNs because its high packaging density will decrease signal propagation delay and reduce electromagnetic emission.The direct immersion cooling module [4] has been considered a promising method for such application because it removes a large amount of heat effectively. However, application of such a cooling method to communication systems is not an easy task because of dif culties in maintenance and reliability.…”

mentioning

confidence: 99%

mentioning

confidence: 99%

“…Correspondingly, the heat ux in a B-ISDN is one or two orders of magnitude higher than in conventional systems, and will reach 1-2 W/cm 2 , which will necessitate new packaging systems and ingenious cooling technology [1,2]. The multichip module (MCM) has been considered [3] thermosyphon cooling module, which has a horizontal refrigerant path in the heat sink [5,6], brings signi cant heat transfer crisis and consequent temperature rise due to the retardation of boiling inception inside the tube at a lower heat ux of about 1 W/cm 2 . On the other hand, a thermosyphon action due to boiling of the refrigerant in a vertical channel completely eliminates the heat transfer crisis problem [9].…”

mentioning

confidence: 99%

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Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs

Na¹,

Jeon²,

Kwak³

et al. 2001

Heat Transfer Engineering

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Thermosyphon cooling modules, to cool multichip modules (MCMs), were designed and tested. The cooling module consists of a cold plate with micro nned channels and a plate-type integrated condenser. A separate ow model was employed to predict the mass ux and the pressure drop in the channel of the cold plate. The local and average convective boiling heat transfer coef cients and the corresponding wall superheat were calculated using the Chen's correlation. Experiments were performed to nd out how the thermal performance of the cooling module was affected by the condenser size and the amount of charging uid. Great emphasis was placed on the transient characteristics of the cooling module. For an allowable temperature rise of 58°C on the surface of the heater, the cooling module can handle a heat ux of as much as 2.5 W/cm 2 . No boiling retardation was observed inside the cold plate, which resulted in smooth transition from the transient state to the steady one. It was also found that the appropriate size of the condenser and the adequate amount of charging liquid are crucial factors affecting the performance of a closed two-phase thermosyphon device.Switching systems in a broadband integrated services digital network (B-ISDN) will use the asynchronous transfer mode (ATM) and will have a throughput on the order of terabits per second. Correspondingly, the heat ux in a B-ISDN is one or two orders of magnitude higher than in conventional systems, and will reach 1-2 W/cm 2 , which will necessitate new packaging systems and ingenious cooling technology [1,2]. The multichip module (MCM) has been considered [3] an appropriate packaging design for B-ISDNs because its high packaging density will decrease signal propagation delay and reduce electromagnetic emission.The direct immersion cooling module [4] has been considered a promising method for such application because it removes a large amount of heat effectively. However, application of such a cooling method to communication systems is not an easy task because of dif culties in maintenance and reliability. As an alternative, ingeneous air-cooled thermosyphon modules [5,6] and indirect liquid-cooling thermosyphons [7,8] have been proposed for cooling high-density electronic packaging. However, it has been observed [9] that the 29

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Section: Experimental Apparatus and Proceduresmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

“…Correspondingly, the heat ux in a B-ISDN is one or two orders of magnitude higher than in conventional systems, and will reach 1-2 W/cm 2 , which will necessitate new packaging systems and ingenious cooling technology [1,2]. The multichip module (MCM) has been considered [3] thermosyphon cooling module, which has a horizontal refrigerant path in the heat sink [5,6], brings signi cant heat transfer crisis and consequent temperature rise due to the retardation of boiling inception inside the tube at a lower heat ux of about 1 W/cm 2 . On the other hand, a thermosyphon action due to boiling of the refrigerant in a vertical channel completely eliminates the heat transfer crisis problem [9].…”

mentioning

confidence: 99%

See 2 more Smart Citations

Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs

Na¹,

Jeon²,

Kwak³

et al. 2001

Heat Transfer Engineering

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“…We have developed a multichip switching module using copperpolyimide multilayer substrate [6] and confirmed its operation at 1.8 Gb/s. The multichip module has many advantages in terms of synchronization as well as transmission characteristics, and it increases switching speed by about 200%.…”

Section: Stm High-speed Space-division Switching Networkmentioning

confidence: 78%

Optical wavelength-division multiplexing high-speed switching system for B-ISDN

Kikuchi

Yamanaka²,

Shimazu³

IEEE Global Telecommunications Conference GLOBECOM '91: Countdown to the New Millennium. Conference Record

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An optical wavelength-division multiplexing (WDM) subscriber network architecture and an economical introduction scenario for B-ISDN services are proposed. B-ISDN services are integrated into an optical WDM subscriber network by using a different wavelength for each service. Key technologies for each of the introduction scenario's five stages are described, and some preliminary results obtained with them are presented. These technologies are (1) optical WDM subscriber lines, (2) a multichip space-division switching module, (3) time-and wavelength-division optical distribution, (4) a highthroughput ATM switching module, and (5) a time-division 52-Mb/s switching module with a throughput of 9.6 Gb/s.

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3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules

Sasaki

Konno

Tomimuro

et al. 1991

IEEE Trans. Comp., Hybrids, Manufact. Technol.

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Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate

Cited by 26 publications

References 8 publications

Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs

Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs

Optical wavelength-division multiplexing high-speed switching system for B-ISDN

3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules

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