Multi-scale modeling of thermal expansion coefficients of C/C composites at high temperature

Ai, Shigang; Fu, Hailong; He, Rujie; Pei, Yongmao

doi:10.1016/j.matdes.2015.05.061

Cited by 49 publications

(10 citation statements)

References 30 publications

(35 reference statements)

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“…Carbon–carbon (C/C) composites are widely used in the aerospace and nuclear industries due to their superior properties, such as low density, high corrosion resistance, high thermal conductivity with low coefficient of thermal expansion and good frictional performance [1,2,3]. Therefore, these composites are extensively used in aircraft brake systems [4] and as nozzle throat inserts in solid rocket motors [5,6].…”

Section: Introductionmentioning

confidence: 99%

Effect of Needling Parameters and Manufacturing Porosities on the Effective Thermal Conductivity of a 3D Carbon–Carbon Composite

et al. 2019

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Needle-punching is used as an alternative to expensive and sophisticated three-dimensional (3D) weaving processes to prepare a 3D composite. In this study, a 3D needled carbon–carbon (C/C) composite structure was examined using X-ray tomography and scanning electron microscopy (SEM). The effects of manufacturing porosities, needling diameter and needling density on the thermal conductivity of the composite were determined through multiscale finite-element modelling. The degradation of thermal conductivity caused by the manufacturing porosity was higher in the longitudinal direction than in the through-thickness direction. Moreover, it was found that the through-thickness thermal conductivity of the composites increased with increasing needling diameter and density.

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Section: Introductionmentioning

confidence: 99%

Effect of Needling Parameters and Manufacturing Porosities on the Effective Thermal Conductivity of a 3D Carbon–Carbon Composite

et al. 2019

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“…Carbon fiber-reinforced composites are currently more and more used in structural applications that involve various temperature ranges [1]. When excessive temperature differences occur in a composite structure or its surrounding, the disequilibrium of the potential volumetric changes or mismatch of structural deformations in this kind of composite are very complicated.…”

Section: Introductionmentioning

confidence: 99%

A mesoscale study of thermal expansion behaviors of epoxy resin and carbon fiber/epoxy unidirectional composites based on periodic temperature and displacement boundary conditions

et al. 2016

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The thermal expansion behaviors of neat epoxy resin and carbon fiber/epoxy unidirectional (UD) composites were experimentally and numerically studied in this paper. The dynamic mechanical analysis (DMA), thermogravimetric analysis (TG), differential scanning calorimetry (DSC) and thermal conductivity measurement were used to measure the thermo-mechanical properties of epoxy resin at different temperatures. The dilatometer was used to measure the thermal strains and linear CTEs of neat epoxy resin and UD composites. In addition, a mesoscale finite element model based on the periodic temperature and displacement boundary conditions was presented to analyze the thermal expansion behaviors of UD composites. The resin-voids representative volume element (RVE) was used to calculate the thermo-mechanical properties of several kinds of resin-voids mixed matrix. From the results it can be found that the glass transition temperature of epoxy resin, porosity and fiber orientation angle have significant effects on the thermal expansion behaviors of UD composites. The mesoscale finite element analyses (FEA) have obvious advantages than various existing analysis models by comparing their predictive results. The distributions of thermal displacement, thermal stress and thermal strain were extracted between the carbon fiber, resin-voids mixed matrix and their interface, and also between the front and back surfaces of the loading direction, to further investigate thermal expansion structure effects of UD composites. This paper revealed that the mesoscale FEA based on periodic temperature and displacement boundary conditions can be also used for thermal expansion researches of other complex structure composites.

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“…Many researchers (Ai, Fu, and He et al 2015;Dong et al 2017;Wang, Wang, and Dong et al 2013) revealed that alternate heating and cooling composite materials could lead to laminates' effective failure. During thermal treatment, besides peak temperature, both the holding time at peak temperature and thermal shock cycle times would exert a non-negligible influence on interface damage during thermal pretreatment.…”

Section: Introductionmentioning

confidence: 99%

Effect of thermal shock process on the microstructure and peel resistance of single–sided copper clad laminates used in waste printed circuit boards

Liu

Wan

Wang

et al. 2019

Journal of the Air & Waste Management Association

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Efficient pre-processing is essential to the mechanical recovery of waste printed circuit boards (WPCBs). In this work, a thermal shock pretreatment was utilized to damage the interface between metals and nonmetals of single-sided copper clad laminates (SSCCLs), which are usually employed as the base material of printed circuit boards (PCBs). The effects of three thermal shock treatment parameters-i.e., peak temperature, holding time, and thermal shock cycle times-on the adhesion strength of SSCCLs were evaluated by orthogonal experiments. Microstructures and peel resistance of SSCCLs before and after thermal shock were characterized by scanning electron microscopy (SEM) and 90°peel test, respectively. Our results showed that the impact of three major factors that influence liberation efficiency was in the sequence of peak temperature > shock cycle times > holding time. Furthermore, the optimal thermal shock level could be achieved when the peak temperature was 300°C with the soaking time of 30 min and three cycle times. In the meantime, the corresponding peel strength of the SSCCLs (0.065 N/mm) was sharply decreased by 94% in comparison with those without thermal shock treatment. The manual dismantling experimental data verified the good feasibility of the optimal thermal shock process, suggesting that the copper foil could be readily dismantled from the substrate by hand after pretreatment, with a successful separation rate of 100% and a peeling efficiency of~30 seconds per piece. Therefore, the optimal thermal shock process could notably improve liberation of metals and nonmetals, which would be helpful for efficient recycling of WPCBs.Implications: The interface between copper foil and laminate dielectric in a PCB can be weakened significantly via efficient thermal shock method. Thus, a good liberation could be achieved after thermal shock. In this work, a manual peeling of copper foil from the SSCCL substrates was achieved efficiently after optimal thermal shock pretreatment, confirming the feasibility of a shorter process of metal recovery from scrap SSCCLs without pulverization. The results will be useful for the pretreatment of recovery of the WPCBs.

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Multi-scale modeling of thermal expansion coefficients of C/C composites at high temperature

Cited by 49 publications

References 30 publications

Effect of Needling Parameters and Manufacturing Porosities on the Effective Thermal Conductivity of a 3D Carbon–Carbon Composite

Effect of Needling Parameters and Manufacturing Porosities on the Effective Thermal Conductivity of a 3D Carbon–Carbon Composite

A mesoscale study of thermal expansion behaviors of epoxy resin and carbon fiber/epoxy unidirectional composites based on periodic temperature and displacement boundary conditions

Effect of thermal shock process on the microstructure and peel resistance of single–sided copper clad laminates used in waste printed circuit boards

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